Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, a plurality of printhead dies each mounted on the carrier and communicating with the fluid manifold, and a fluid delivery assembly coupled with the carrier and communicating with the fluid manifold.

Abstract: A printhead assembly includes a carrier having a fluid manifold defined therein, a plurality of printhead dies each mounted on the carrier and communicating with the fluid manifold, and a fluid delivery assembly coupled with the carrier and communicating with the fluid manifold.

Abstract: An electrostatic discharge protection system for use in connection with a pulley or sprocket of the type having a central hub portion and opposite side portions. The hub portion is electrically non-conductive and is rotatably carried on a conductive shaft. The side portions are provided with conductive portions or members. A zener diode is connected between each conductive portion and the conductive shaft to enable electrostatic charges on each side of the pulley or sprocket to be safely drained off. Electrostatic charges present on strip material drawn over a pulley, sprocket or guide are also drained with the protection system. The system is also useful in connection with fixed guides which do not rotate.

Abstract: A device for transferring semiconductor wafers from a first wafer carrier to a second wafer carrier with each wafer carrier having a pair of grooved sides for receiving and holding a number of vertically spaced wafers in horizontal planes and with each wafer carrier having front and rear openings. The device comprises a base having a flat upper surface. A wall member is secured to and extends upwardly from the surface midway between the sides thereof and near one end of the base. The wall member is spaced above the surface to present a slot for receiving a web forming a part of the wafer carrier as the wafer carrier moves over the surface. The wall member has a vertical end face which enters a wafer carrier as the wafer carrier is moved over the surface, whereby the wall member forces the wafers out of the first wafer carrier and into the second wafer carrier while the wafers remain in horizontal planes and vertically spaced with respect to each other.