Abstract: A capacitively-coupled amplifier circuit includes an amplifier for receiving an input signal via a coupling capacitance and for amplifying the input signal to produce an output signal. A resistor provides a bias voltage to the amplifier. The resistor is bootstrapped using positive feedback with a loop gain of slightly less than one. The bootstrapping causes an increase in the value of the resistor to lower the cut-in (pole) frequency of the amplifier. The bootstrapping or feedback circuit includes a roll-off (pole) at a frequency below the roll-off (pole) frequency of the amplifier. This prevents phase shift in the feedback loop from adversely effecting the high frequency response of the amplifier. The resulting amplifier circuit exhibits a wide passband and excellent low frequency response despite having a capacitively coupled input signal.

Abstract: The invention is a capacitively coupled probe which can be used for non-contact acquisition of both analog and digital signals. The probe includes a shielded probe tip, a probe body which is mechanically coupled to the probe tip, and an amplifier circuit disposed within the probe body. The amplifier circuit receives a capacitively sensed signal from the probe tip and produces an amplified signal in response thereto. The amplifier has a large bandwidth to accommodate high-frequency digital signals. Further, the amplifier has a very low input capacitance and a high input resistance to reduce signal attenuation and loading of the circuit being probed. The amplifier circuit is disposed in the probe body closely adjacent to the probe tip in order to reduce stray and distributed capacitances. A reconstruction circuit reconstructs digital signals from the amplified capacitively sensed signal.

Abstract: A method and apparatus for analyzing a semiconductor device having a diode formed therein. In its broadest sense, the invention involves irradiating the semiconductor device with electromagnetic radiation while monitoring the leakage current output from the diode contained in the semiconductor device. If the semiconductor device is present and properly soldered to the printed circuit board, an increase in the leakage current will be observed during the irradiation process. The increase in leakage current is also representative of the presence of intact bond wires at both the pin under test and the ground pin. The invention in a preferred form is shown to include a voltage source, electrically connected to the diode, for biasing the diode in a reverse direction, a current monitor, connected to monitor the leakage current from the diode and an electromagnetic radiation generator, positioned to provide electromagnetic radiation incident on the semiconductor device.

Abstract: Apparatus for classifying beats in EKG signals from two sets of electrodes in which the respective signals are applied to different channels and the classification is derived from a simultaneous analysis of the signals provided by the two channels based on the quality of the channels and physiological factors of the signals.