Patents by Inventor John M. Hokanson

John M. Hokanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9186486
    Abstract: Medical systems and methods including balloons having nanotubes are disclosed. In some embodiments, a medical system includes an elongated shaft, and an expandable balloon carried by the shaft and including nanotubes. The medical system is capable of cooling the balloon to less than about 37° C. In some embodiments, a method includes providing a medical device having an elongated shaft, and an expandable balloon carried by the elongated shaft and including nanotubes; and cooling the balloon to less than about 37° C.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: November 17, 2015
    Assignee: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Jan Weber, John M. Hokanson, John J. Chen
  • Patent number: 8343143
    Abstract: Medical systems and methods including balloons having nanotubes are disclosed. In some embodiments, a medical system includes an elongated shaft, and an expandable balloon carried by the shaft and including nanotubes. The medical system is capable of cooling the balloon to less than about 37° C. In some embodiments, a method includes providing a medical device having an elongated shaft, and an expandable balloon carried by the elongated shaft and including nanotubes; and cooling the balloon to less than about 37° C.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: January 1, 2013
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Jan Weber, John M. Hokanson, John H. Chen
  • Publication number: 20100286678
    Abstract: Medical systems and methods including balloons having nanotubes are disclosed. In some embodiments, a medical system includes an elongated shaft, and an expandable balloon carried by the shaft and including nanotubes. The medical system is capable of cooling the balloon to less than about 37° C. In some embodiments, a method includes providing a medical device having an elongated shaft, and an expandable balloon carried by the elongated shaft and including nanotubes; and cooling the balloon to less than about 37° C.
    Type: Application
    Filed: July 19, 2010
    Publication date: November 11, 2010
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Jan Weber, John M. Hokanson, John H. Chen
  • Patent number: 7758572
    Abstract: Medical systems and methods including balloons having nanotubes are disclosed. In some embodiments, a medical system includes an elongated shaft, and an expandable balloon carried by the shaft and including nanotubes. The medical system is capable of cooling the balloon to less than about 37° C. In some embodiments, a method includes providing a medical device having an elongated shaft, and an expandable balloon carried by the elongated shaft and including nanotubes; and cooling the balloon to less than about 37° C.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: July 20, 2010
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Jan Weber, John M. Hokanson, John J. Chen
  • Patent number: 5052105
    Abstract: A micro-cable interconnect comprises a single exterior flexible insulative coating internally containing a plurality of terminally prepared, precisely spaced conductors. The conductors are arranged with a spacing and pitch to identically match spacing and pitch of interconnect zones operatively connected to an integrated circuit or connector, with the conductors constructed and arranged for bonding to the interconnect zones.
    Type: Grant
    Filed: June 5, 1990
    Date of Patent: October 1, 1991
    Assignee: Hutchinson Technology, Inc.
    Inventors: Hans A. Mische, Wallace J. Devries, John M. Hokanson, Daniel J. Klima, Steven P. Mertens
  • Patent number: 4718164
    Abstract: A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.
    Type: Grant
    Filed: October 15, 1986
    Date of Patent: January 12, 1988
    Assignee: Hutchinson Technology Inc.
    Inventors: John M. Hokanson, Ronald Weispfenning
  • Patent number: 4700044
    Abstract: Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.
    Type: Grant
    Filed: July 31, 1986
    Date of Patent: October 13, 1987
    Assignee: Hutchinson Technology Inc.
    Inventors: John M. Hokanson, Kenneth S. Bentz, Terrence G. Field, David A. Ziegler