Patents by Inventor John M. Knapp

John M. Knapp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7679242
    Abstract: An electrical motor for an electrical submersible pump wherein the electrical motor has increased heat transfer capabilities. The electrical motor includes a housing and a plurality of stator laminations within the housing. Each stator lamination defines a central orifice and a plurality of lamination slots. A plurality of magnet wires pass through each of the plurality of lamination slots formed by the stacked plurality of stator laminations. Shrink wrap surrounds each of the plurality of magnet wires to secure the magnet wires in bundles. The result is that the wires are effectively bound together in a manner that allows oil to move freely inside the lamination slots surrounding the wire bundles. Since fluid can pass between and around the windings, the overall winding temperature will be normalized, essentially reducing hot spots that occur in prior art designs.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: March 16, 2010
    Assignee: Baker Hughes Incorporated
    Inventors: Larry J. Parmeter, John M. Knapp
  • Publication number: 20090091202
    Abstract: An electrical motor for an electrical submersible pump wherein the electrical motor has increased heat transfer capabilities. The electrical motor includes a housing and a plurality of stator laminations within the housing. Each stator lamination defines a central orifice and a plurality of lamination slots. A plurality of magnet wires pass through each of the plurality of lamination slots formed by the stacked plurality of stator laminations. Shrink wrap surrounds each of the plurality of magnet wires to secure the magnet wires in bundles. The result is that the wires are effectively bound together in a manner that allows oil to move freely inside the lamination slots surrounding the wire bundles. Since fluid can pass between and around the windings, the overall winding temperature will be normalized, essentially reducing hot spots that occur in prior art designs.
    Type: Application
    Filed: October 3, 2007
    Publication date: April 9, 2009
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: LARRY J. PARMETER, John M. Knapp