Abstract: In accordance with the present invention, there is provided a CPV package which comprises a leadframe assembly, such leadframe assembly including multiple frames stacked on top of each other. A top frame of the leadframe assembly provides the electrical interconnect between the top or front surface of the receiver die and the bypass diode required to complete the circuit. The top frame also provides hook up wire interconnect pads for the completed CPV package. An exposed bottom surface of a bottom frame of the leadframe assembly defines a heat spreader which assists in thermal management. The fabrication of the CPV package to include multiple frames stacked on top of each other provides high thermal dissipation and high voltage isolation, while at the same providing a high level of reliability with a comparatively low manufacturing cost.

Abstract: A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.