Abstract: An end effector for a pod loader interface includes a gripper plate that attaches to the articulated arm. A pair of gripper blades are separated from each other along and are coupled to the gripper plate. During gripping of a wafer carrier, the gripper blades initially close toward each other and then draw nearer to the gripper plate. Nested outer and inner U-shaped yokes, which may attach the gripper plate to the articulated arm, are joined by rotational joints to permit their relative rotation for reorienting the wafer carrier. Yet other aspect of the present invention are a mechanical forearm drive that provides substantially linear motion of an articulated arm's wrist joint, and an end effector rotary-drive included in a forearm of the articulated arm.

Abstract: A three DOF SCARA arm, adapted for transporting semiconductor wafers, includes an end-effector assembly at a distal joint of the arm. In one configuration, the end-effector turns a workpiece over. The arm includes a support column having an open column assembly that projects above a base. Within the assembly, a Z-axis drive energizes extension and retraction of a hollow tube carried by the support column. A shaft, rotatable about the Z-axis and having a distal end furthest from the support column's base, receives an arm assembly. An arm-assembly rotary-drive energizes the shaft's rotation. An arm base-plate, secured to the shaft's distal end, supports the arm assembly therefrom. The arm base-plate carries a wrist joint that is displaced from the Z-axis, and receives the end-effector whose rotation about a wrist-joint axis is energized by an end-effector rotary-drive.

Abstract: A three DOF SCARA arm, adapted for transporting semiconductor wafers, includes an end-effector assembly at a distal joint of the arm. In one configuration, the end-effector turns a workpiece over. The arm includes a support column having an open column assembly that projects above a base. Within the assembly, a Z-axis drive energizes extension and retraction of a hollow tube carried by the support column. A shaft, rotatable about the Z-axis and having a distal end furthest from the support column's base, receives an arm assembly. An arm-assembly rotary-drive energizes the shaft's rotation. An arm base-plate, secured to the shaft's distal end, supports the arm assembly therefrom. The arm base-plate carries a wrist joint that is displaced from the Z-axis, and receives the end-effector whose rotation about a wrist-joint axis is energized by an end-effector rotary-drive.

Abstract: A system includes an interface for receiving a pod having a carrier that receives wafers, and that is initially enclosed within a base and a pod cover. The system also includes a mechanism that transfers an exposed carrier between the interface and a platform of a mass-transfer machine included in the system. The machine includes a gantry arm for transferring the carrier between the platform and a transfer station. A retainer assembly is positionable over the carrier at the transfer station, and over a process carrier that is used in a processing tool. Moveable retainers of the assembly receive and hold wafers. The machine includes an elevator that moves between the transfer station and the process carrier. The elevator extends and retracts for transferring wafers between the retainers and either the carrier or the process carrier. A turntable, that receives the process carrier, permits automatically reorienting wafers.

Abstract: A method for unloading silicon wafers contained in a cassette from a sealed pod and supplying the wafers to an IC manufacturing process. The method includes receiving a base of the pod onto a loading platform of a pod loader interface and then unlocking the pod cover from the base. While maintaining the wafers in a clean mini-environment, the method raises the pod cover away from the base, contacts the now exposed cassette with an end effector of an articulated arm, secures the cassette to the end effector, and activates the arm to transport the wafers out of mini-environment for supplying the wafers to an IC manufacturing process. Preferably, the method further includes raising the articulated arm to lift the cassette before transferring the wafers to the process. Even more preferred, the method directs a flow of clean air within the mini-environment horizontally past the wafers.

Abstract: The pod loader interface is a machine that is able to automatically open a SMIF pod and unload the contents thereof. An elevator raises the SMIF cover away from its base to reveal the wafer boat contained in the SMIF pod. An articulated arm thereafter reaches through an opening in a bulkhead of the machine, securing the wafer cassette and withdrawing it through the hole in the bulkhead. The wafer cassette is then placed in position to be operated upon by the next step in the manufacturing process. The machine includes an integrated clean air system to provide a clean environment for the wafers.

Abstract: A fan is attached directly adjacent to a clean air filter sealing an air inlet under a horizontal portion of a plenum chamber below a vertically movable loading platform which all move as a unit. A vertical portion of the plenum chamber, trapezoidal in cross-section, communicates with a wafer pod on the loading platform through an angled perforated grill sealing an air outlet from the vertical portion of the plenum chamber. Clean air flows evenly throughout the entire height of an angled perforated grill over the surfaces of the wafers. Mechanisms lift the pod cover and load and unload the wafer carrier.

Abstract: A system includes an interface for receiving a pod having a carrier that receives wafers, and that is initially enclosed within a base and a pod cover. The system also includes a mechanism that transfers an exposed carrier between the interface and a platform of a mass-transfer machine included in the system. The machine includes a gantry arm for transferring the carrier between the platform and a transfer station. A retainer assembly is positionable over the carrier at the transfer station, and over a process carrier that is used in a processing tool. Moveable retainers of the assembly receive and hold wafers. The machine includes an elevator that moves between the transfer station and the process carrier. The elevator extends and retracts for transferring wafers between the retainers and either the carrier or the process carrier. A turntable, that receives the process carrier, permits automatically reorienting wafers.

Abstract: A wafer sorting system utilizing optical character recognition and optical "gate sensors" to determine the orientation of the wafers for prealigning. It is envisioned that the machine will be installed in conjunction with a computer controller and multiple cassette stations. A first end of a transfer arm of a robot is equipped with an end effector to transfer individual wafers. The end effector of the transfer arm is extendable and retractable to select and remove the desired wafer from its cassette, and to transfer it to the prealigner or a target cassette in its proper orientation. The end effector includes a vacuum pickup and a sensor that enables detection of presence or absence of wafers in the cassette, and any misaligned wafers in the cassette. Further gate sensors are mounted on the prealigner to accomplish the orientation function prior to the wafer being placed on the prealigner chuck. Multiple perimeter points are used to determine the position of the center of the wafer.

Abstract: An ionized airflow manifold for static reduction. The manifold may be installed in a stand-alone frame, or attached to any processing machine. The manifold includes a commercially available gas ionizer that provides an ionized air supply, and creates an air curtain around a target area.

Abstract: The present invention is a rotary, 3-stage wafer transfer machine. The transfer machine utilizes a pneumatically powered lift mechanism to raise wafers from a boat to a retaining area. If the next operation for the wafer is a single density operation (twenty-five wafers per boat), the wafers are the simply transferred to another boat for further processing. If the next operation for the wafers requires double density (fifty wafers per boat), a second set of wafers is lifted to the retaining area, where they are interspersed with the first set to create a double density set of fifth wafers. This set is then transferred to the appropriate boat (generally a quartz boat) for further processing. All components that could generate particulate contamination are sealed off from the transfer area. Extra duty materials are used for the components of the machine to provide unique reproducibility and eliminate much of the required maintenance as compared to the prior art.