Patents by Inventor John M. Ryba

John M. Ryba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate wiring patterns for connecting to integrated-circuit chips
    Patent number: 4495377
    Abstract: An IC chip connects to a substrate by a pattern of pads arranged in single lines along the radial edges of segments of a polygon underlying the chip-linear conductors from the pads cross the outer edge of the segments in parallel groups. Wider power conductors can also be placed in the pattern.
    Type: Grant
    Filed: December 30, 1982
    Date of Patent: January 22, 1985
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Johnson, John M. Ryba