Abstract: A real-time implementation of a subspace tracker is disclosed. Efficient architecture addresses the unique computational elements of the Fast Approximate Subspace Tracking (FAST) algorithm. Each of these computational elements can scale with the rank and size of the subspace. One embodiment of architecture described is implemented in digital hardware that performs variable rank subspace tracking using the FAST algorithm. In particular, the FAST algorithm is effectively implemented by a few processing elements, coupled with an efficient Singular Vector Decomposition (SVD), and the realization/availability of high density programmable logic devices. The architecture enables the ability to track the possibly changing dimension of the signal subspace.

Abstract: A two-plane rotation (TPR) approach to Gaussian elimination (Jacobi) is used for computational efficiency in determining rotation parameters. A rotation processor is constructed using the TPR approach to perform singular value decomposition (SVD) on two by two matrices yielding both eigenvalues and left and right eigenvectors. The rotation processor can then be replicated and interconnected to achieve higher dimensioned matrices. For higher dimensional matrices, the rotation processors on the diagonal solve the 2×2 rotation angles, broadcast the results to off-diagonal processors, whereby all processors perform matrix rotations in parallel.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store flat-panel display substrates. A first set of one or more multi-axis robot arms may transfer one or more flat-panel display substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer flat-panel display substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store semiconductor substrates. A first set of one or more multi-axis robot arms may transfer one or more semiconductor substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer semiconductor substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. The apparatus may process semiconductor substrates with a selected diameter in a range from about 100 mm to about 450 mm.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store magnetic media substrates. A first set of one or more multi-axis robot arms may transfer one or more magnetic media substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer magnetic media substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. One or more multi-axis robot arms in the substrate transfer chamber may transfer semiconductor substrates between the load lock chamber and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a process chamber. A gas manifold is directly connected to an outer surface of the process chamber. The gas manifold may provide one or more gases to the process chamber.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: Compositions and methods for the therapy and diagnosis of cancer, particularly breast cancer, are disclosed. Illustrative compositions comprise one or more breast tumor polypeptides, immunogenic portions thereof, polynucleotides that encode such polypeptides, antigen presenting cell that expresses such polypeptides, and T cells that are specific for cells expressing such polypeptides. The disclosed compositions are useful, for example, in the diagnosis, prevention and/or treatment of diseases, particularly breast cancer.

Abstract: Compositions and methods for the detection and therapy of breast cancer are disclosed. The compounds provided include nucleotide sequences that are preferentially expressed in breast tumor tissue, as well as polypeptides encoded by such nucleotide sequences. Vaccines and pharmaceutical compositions comprising such compounds are also provided and may be used, for example, for the prevention and treatment of breast cancer. The polypeptides may also be used for the production of antibodies, which are useful for diagnosing and monitoring the progression of breast cancer in a patient.

Abstract: Compositions and methods for the therapy and diagnosis of cancer, particularly breast cancer, are disclosed. Illustrative compositions comprise one or more breast tumor polypeptides, immunogenic portions thereof, polynucleotides that encode such polypeptides, antigen presenting cell that expresses such polypeptides, and T cells that are specific for cells expressing such polypeptides. The disclosed compositions are useful, for example, in the diagnosis, prevention and/or treatment of diseases, particularly breast cancer.

Abstract: A textile article having flame resistant properties includes a plurality of inherently flame resistant polyester fibers formed into a fabric, and a finish on the fabric including a cyclic phosphonate flame retardant. The finish imparts a property selected from the group consisting of: a molecularly bound antimicrobial agent which is an organosilane, a fluorochemical soil and fluid repellant, and the finished textile article has a flame resistance that passes the standard method NFPA 701-1996 edition testing protocol.

Abstract: Compositions and methods for the therapy and diagnosis of cancer, particularly breast cancer, are disclosed. Illustrative compositions comprise one or more breast tumor polypeptides, immunogenic portions thereof, polynucleotides that encode such polypeptides, antigen presenting cell that expresses such polypeptides, and T cells that are specific for cells expressing such polypeptides. The disclosed compositions are useful, for example, in the diagnosis, prevention and/or treatment of diseases, particularly breast cancer.

Abstract: Apparatus can comprise an anoxic zone, an aeration zone in communication with the anoxic zone, and a sedimentation zone in communication with the aeration and anoxic zones. The sedimentation zone may include a first outlet in a lower portion thereof adapted to recycle material. A device may be provided to control the flow rate of the recycle material. Another device may be positioned relative to a sedimentation zone inlet and adapted to manipulate a material flow profile as material travels into the sedimentation zone. A sedimentation zone may also define an inlet comprising an overlapped area. Methods for purifying a waste inlet material comprise the steps of providing an anoxic zone, an aeration zone and a sedimentation zone. The methods may comprise the step of recycling material from a first outlet in a lower portion of the sedimentation zone.