Abstract: An ultrasonic instrument includes a body, an actuation assembly, a shaft assembly, and an end effector. The actuation assembly includes an activation member that is operable to move in a first direction to select a mode of operation. The shaft assembly extends distally from the body and includes an acoustic waveguide. The end effector includes an ultrasonic blade that is in acoustic communication with the acoustic waveguide. The activation member is operable to move in a second direction to activate the end effector in a mode of operation selected by movement of the activation member in the first direction.

Abstract: Distribution and management of services in virtual environments is described herein. In one or more implementations, a service distribution and management model is implemented in which system services and applications are seamlessly distributed across multiple containers which each implement a different runtime environment. In one or more implementations, a system for distributing access to services in a host operating system of a computing device includes a host operating system configured to implement a host runtime environment, and one or more services implemented by the host operating system. The system further includes a service control manager configured to enable communication between a client stub of a service implemented in a client runtime environment and a service provider of the service that is implemented in a service runtime environment that is separate from the first client runtime environment.

Abstract: A power tool may include a compartment in its housing and a first printed circuit board (PCB) located in the housing and electrically coupled to a first connector. An insertable wireless communication device may include a second electronic processor and an antenna that are each mounted to a second PCB. The insertable wireless communication device may be configured to be received in the compartment and may include a second connector configured to electrically and physically couple to the first connector. The insertable wireless communication device may be configured to wirelessly communicate with an external device. When the insertable wireless communication device is inserted into the compartment, a first conductive layer of the first PCB may be configured to be electrically coupled to the antenna via the first connector and the second connector such that the first conductive layer of the first PCB serves as a ground plane of the antenna.

Abstract: The Internet can be configured to provide communications to a large number of Internet-of-Things (IoT) devices. Devices can be designed to address the need for network layers, from central servers, through gateways, down to edge devices, to grow unhindered, to discover and make accessible connected resources, and to support the ability to hide and compartmentalize connected resources. Network protocols can be part of the fabric supporting human accessible services that operate regardless of location, time, or space. Innovations can include service delivery and associated infrastructure, such as hardware and software. Services may be provided in accordance with specified Quality of Service (QoS) terms. The use of IoT devices and networks can be included in a heterogeneous network of connectivity including wired and wireless technologies.

Abstract: A trusted communications environment includes a primary participant with a group creator and a distributed ledger, and a secondary participant with communication credentials. An Internet of Things (IoT) network includes a trusted execution environment with a chain history for a blockchain, a root-of-trust for chaining, and a root-of-trust for archives. An IoT network includes an IoT device with a communication system, an onboarding tool, a device discoverer, a trust builder, a shared domain creator, and a shared resource directory. An IoT network includes an IoT device with a communication system, a policy decision engine, a policy repository, a policy enforcement engine, and a peer monitor. An IoT network includes an IoT device with a host environment and a trusted reliability engine to apply a failover action if the host environment fails. An IoT network includes an IoT server including secure booter/measurer, trust anchor, authenticator, key manager, and key generator.

Abstract: A charging contact assembly can include a brush for configured to translate in a first direction generally perpendicular to a second direction of travel of the charging contact assembly. The brush can include a first contact surface for contacting the conducting surface, and a second contact surface parallel to the first direction of translation of the brush and perpendicular to the second direction of travel of the charging contact assembly. The charging contact assembly can also include a connector having a connection for connecting to a source of electrical energy, and a connector contact surface electrically coupled with the connection and arranged parallel to the second contact surface of the brush to contact the second contact surface of the brush. The charging contact assembly can further include a biasing mechanism for biasing the connector contact surface of the connector into contact with the second contact surface of the brush.

Abstract: A real-time implementation of a subspace tracker is disclosed. Efficient architecture addresses the unique computational elements of the Fast Approximate Subspace Tracking (FAST) algorithm. Each of these computational elements can scale with the rank and size of the subspace. One embodiment of architecture described is implemented in digital hardware that performs variable rank subspace tracking using the FAST algorithm. In particular, the FAST algorithm is effectively implemented by a few processing elements, coupled with an efficient Singular Vector Decomposition (SVD), and the realization/availability of high density programmable logic devices. The architecture enables the ability to track the possibly changing dimension of the signal subspace.

Abstract: A two-plane rotation (TPR) approach to Gaussian elimination (Jacobi) is used for computational efficiency in determining rotation parameters. A rotation processor is constructed using the TPR approach to perform singular value decomposition (SVD) on two by two matrices yielding both eigenvalues and left and right eigenvectors. The rotation processor can then be replicated and interconnected to achieve higher dimensioned matrices. For higher dimensional matrices, the rotation processors on the diagonal solve the 2×2 rotation angles, broadcast the results to off-diagonal processors, whereby all processors perform matrix rotations in parallel.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a process chamber. A gas manifold is directly connected to an outer surface of the process chamber. The gas manifold may provide one or more gases to the process chamber.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store magnetic media substrates. A first set of one or more multi-axis robot arms may transfer one or more magnetic media substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer magnetic media substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store semiconductor substrates. A first set of one or more multi-axis robot arms may transfer one or more semiconductor substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer semiconductor substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring magnetic media substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring flat-panel display substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. The apparatus may process semiconductor substrates with a selected diameter in a range from about 100 mm to about 450 mm.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. One or more multi-axis robot arms in the substrate transfer chamber may transfer semiconductor substrates between the load lock chamber and the plurality of process chamber modules under sub-atmospheric conditions.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. Each of the process chamber modules includes a process chamber coupled to a dedicated support system so that each process chamber module can be disconnected from the substrate transfer chamber without disrupting any of the other process chamber modules. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.

Abstract: A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A plurality of storage bays may be used to store flat-panel display substrates. A first set of one or more multi-axis robot arms may transfer one or more flat-panel display substrates between the substrate load lock chamber and the plurality of storage bays. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. A second set of one or more multi-axis robot arms may transfer flat-panel display substrates between the storage bays and the plurality of process chamber modules under sub-atmospheric conditions.