Abstract: Hot spots in power conductors are monitored by apparatus comprising a temperature probe embedded in an electrically insulative thermally conductive material in surface-to-surface contact with the power conductor, typically at a joint being monitored. The temperature probe is spaced from the power conductor by the electrically insulative thermally conductive material a distance sufficient to provide electrical isolation, while the material has sufficient thermal conductivity that the temperature probe is able to substantiate trends in temperature changes at the joint. The invention can be incorporated into existing electrically insulative supports for the power conductors.