Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Abstract: An insulating beverage cup is produced with an air containing film layer disposed on an inner surface of a food or beverage paper stock. The air containing film layer is extruded or laminated to the paper stock. An additional extruded or laminated layer is applied between the air containing film layer and paper stock layer. The insulating coating layer decreases the energy transfer between the beverage and the user's hands allowing the user to hold onto the cup for an extended period of time without causing user discomfort or pain. The exterior surface of the beverage cup remains highly printable and predisposed to high quality graphics.

Abstract: A temperature sensor includes a substantially uniform substrate including a first material and including a first surface, a first contact over the first surface and proximate to a first side of the substrate, and a second contact over the first surface and proximate to a second side of the substrate. The second side is opposite the first side. The second contact is spaced from the first contact by a first distance. The first contact includes a second material different from the first material. The second contact includes the second material. Upon application of a voltage between the first contact and the second contact, a measurable current propagates through a substantial portion of the substrate.

Abstract: A blood gas concentration sensor includes a first housing at least partially defining a first chamber containing a first electrolyte, a first electrode in the first chamber, and a second electrode in the first chamber and substantially parallel to the first electrode. The first housing includes a gas permeable material. The first electrode includes sides and an end. The sides of the first electrode are surrounded by a first insulating layer. The end of the first electrode is in contact with the first electrolyte. The end of the first electrode is not in contact with the first housing. The first electrode includes a first metal. The second electrode includes a second metal. A potential difference between the first metal and the second metal is at least about 0.5 volts.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: Methods of producing a solder bump are presented. Preferred methods lack a requirement for masking a target substrate. Contemplated methods include forming a well around one or more bond pads on a wafer where the walls of the well are formed by a covering layer material, possibly comprising photoresist or passivation material. The well can be filled with a contact material. Contact material can comprise a solder paste or an under bump metallization layer, which can be placed within the wells as a contact bed for solder balls. A priori prepared solder balls, in solid form or in molten form, can deposited on the contact material to produce the solder bump.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: A method of operating chromatography column apparatus comprising a column tube (101) and first and second discrete end cell structures, associated with the respective ends of the column tube and positionable to close off the column tube and define therein a column space for retaining chromatography medium in use of the apparatus. The first end cell portion comprises a piston portion (106) fitting slidably in the column tube. The column tube and the second end cell structure are separated to provide an access spacing between them. The piston portion (106) of the first end cell structure is advanced through the column tube to expose it at the open second end of the column tube, for maintenance of the piston portion thus exposed. Corresponding chromatography apparatus is another aspect of the disclosure.

Abstract: Methods of producing a solder bump are presented. Preferred methods lack a requirement for photoresist processing or masking a target substrate. Contemplated methods include forming a well around one or more bond pads on a wafer where the walls of the well are formed by a passivation layer material. Contact material can comprise a solder paste or an under bump metallization layer, which can be placed within the wells as a contact bed for solder balls. A priori prepared solder balls, in solid form or in molten form, can deposited on the contact material to produce the solder bump.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: A method of operating chromatography column apparatus comprising a column tube (101) and first and second discrete end cell structures, associated with the respective ends of the column tube and positionable to close off the column tube and define therein a column space for retaining chromatography medium in use of the apparatus. The first end cell portion comprises a piston portion (106) fitting slidably in the column tube. The column tube and the second end cell structure are separated to provide an access spacing between them. The piston portion (106) of the first end cell structure is advanced through the column tube to expose it at the open second end of the column tube, for maintenance of the piston portion thus exposed. Corresponding chromatography apparatus is another aspect of the disclosure.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of material having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Abstract: A coated paper stock having high moisture vapor barrier characteristics and ingredient compatible with recycling and repulping is disclosed comprising a substrate coated on at least one surface with a subcoat. The subcoat comprises a hydrolyzed amphoteric vegetable protein at at least 11 weight percent based on weight of the subcoat. A top coat is coated over said subcoat. The top coat consists essentially of a water-based dispersion of a film forming vinyl addition polymer, conjugated diene polymer or copolymer of either polymer, such as acrylic polymers, acrylic copolymers, polyvinyl acetate, polyvinyl alcohol, styrene acrylate copolymers, styrene butadiene copolymers, polyvinylidene chloride and polyvinylidene chloride copolymers. The top coat is substantially free of mineral pigments that interfere with the moisture vapor barrier characteristics. The vegetable protein is preferably a hydrolyzed amphoteric soybean protein with an average molecular weight less than 400,000 Daltons.

Abstract: A drilling system employing a main tubular having a plurality of fluid inlet and outlet conduits positioned thereon and a concentric inner tubular having a plurality seals for sealing the annular space between the concentric inner and main tubulars. The fluid inlet and outlet conduits work in cooperation with the annular seals to selectively open and close for effective management of pressure within the tubulars.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.