Patents by Inventor John Marciniec

John Marciniec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acoustical array with multilayer substrate integrated circuits
    Patent number: 6589180
    Abstract: A high density, exceptionally complex and compact ultrasound transducer array using multi-layer structures composed of active integrated circuit devices on various substrates and passive devices. Electrically conducting interconnections between substrates are implemented with micro-vias configured with conductors extending through the substrates, permitting the use of divided or different integrated circuit technologies arranged and/or isolated within different integrated circuit substrates or layers of the ultrasound transducer assembly. The various layers may be assembled with solders of respectively lower reflow temperatures, to permit testing of selected layers and circuits prior to completion.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: July 8, 2003
    Assignee: Bae Systems Information and Electronic Systems Integration, INC
    Inventors: Kenneth R. Erikson, John Marciniec, Timothy E. White
  • Acoustical array with multilayer substrate integrated circuits
    Publication number: 20030013969
    Abstract: A high density, exceptionally complex and compact ultrasound transducer array using multi-layer structures composed of active integrated circuit devices on various substrates and passive devices. Electrically conducting interconnections between substrates are implemented with micro-vias configured with conductors extending through the substrates, permitting the use of divided or different integrated circuit technologies arranged and/or isolated within different integrated circuit substrates or layers of the ultrasound transducer assembly. The various layers may be assembled with solders of respectively lower reflow temperatures, to permit testing of selected layers and circuits prior to completion.
    Type: Application
    Filed: March 8, 2002
    Publication date: January 16, 2003
    Inventors: Kenneth R. Erikson, John Marciniec, Timothy E. White