Patents by Inventor John Mark Matson

John Mark Matson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Removable interposer
    Patent number: 11251171
    Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Michael Rifani, Robert J. Munoz, Thomas P. Thomas, John Mark Matson, Kursad Kiziloglu
  • REMOVABLE INTERPOSER
    Publication number: 20190385994
    Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Michael Rifani, Robert J. Munoz, Thomas P. Thomas, John Mark Matson, Kursad Kiziloglu