Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract: A resonator sensor module is disclosed. The resonator sensor module includes one or more sensing resonators that includes binding sites for an analyte material; one or more reference resonators that lacks any binding sites for the analyte material; a module interface; and one or more switches each including a first position that operatively couples at least one of the one or more sensing resonators and the module interface and a second position that operatively couples at least one of the one or more reference resonators and the module interface.

Abstract: A resonator sensor module is disclosed. The resonator sensor module includes one or more sensing resonators that includes binding sites for an analyte material; one or more reference resonators that lacks any binding sites for the analyte material; a module interface; and one or more switches each including a first position that operatively couples at least one of the one or more sensing resonators and the module interface and a second position that operatively couples at least one of the one or more reference resonators and the module interface.

Abstract: A resonator sensor module is disclosed. The resonator sensor module includes one or more sensing resonators that includes binding sites for an analyte material; one or more reference resonators that lacks any binding sites for the analyte material; a module interface; and one or more switches each including a first position that operatively couples at least one of the one or more sensing resonators and the module interface and a second position that operatively couples at least one of the one or more reference resonators and the module interface.

Abstract: A resonator sensor module is disclosed. The resonator sensor module includes one or more sensing resonators that includes binding sites for an analyte material; one or more reference resonators that lacks any binding sites for the analyte material; a module interface; and one or more switches each including a first position that operatively couples at least one of the one or more sensing resonators and the module interface and a second position that operatively couples at least one of the one or more reference resonators and the module interface.

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract: A resonator sensor module is disclosed. The resonator sensor module includes one or more sensing resonators that includes binding sites for an analyte material; one or more reference resonators that lacks any binding sites for the analyte material; a module interface; and one or more switches each including a first position that operatively couples at least one of the one or more sensing resonators and the module interface and a second position that operatively couples at least one of the one or more reference resonators and the module interface.