Abstract: The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from semiconductor substrates. The cleaning composition comprises a urea derivative such as, for example, dimethyl urea, as the component that is principally responsible for removing organic residues from the substrate. A fluoride ion source is also included in the cleaning compositions of the present invention and is principally responsible for removing inorganic residues from the substrate. The cleaning compositions of the present invention have a low toxicity and are environmentally acceptable.

Abstract: Surfactant compositions contain one or more compounds according to formula (I) wherein R1 is methyl, ethyl, or 1-propyl; R is a C4-C20 aryl, alkaryl, aralkyl, cyclic, alicyclic, or secondary, branched or bicyclic alkyl group, or a polyhydroxyalkyl group according to formula (A) wherein u is an integer from 0 to 2 and R2 is H, ?-D-glucopyranosyl, ?-D-pyranosyl, or ?-D-galactopyranosyl; and Z is a linking group selected from the group consisting of 4,4?-methylenebis(cyclohexyl); CH2(CH2)n{N+O—R1—CH2(CH2)o}p, where p is an integer from 1 to 10 and n and o are each independently integers from 1 to 5; (CH2)r[O(CH2)s]tO(CH2)q, where s is an integer from 2 to 4, t is an integer from 0 to 2, and r and q are each individually 2 or 3; (CH2)m, where m is an integer from 2 to 6; and isophorone residue (B)

Abstract: Disclosed herein is a fluorinated bridged carbocyclic compound that can be polymerized by itself or with at least one other ethylenically unsaturated monomer to provide a polymer. The polymer may be used, for example, within a sub-300 nm photoresist composition. Also disclosed is a method to make the bridged carbocyclic compound.