Abstract: A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described. Cluster tools incorporating the cooling chamber and methods of using the cooling chamber are also described.

Abstract: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.

Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate anneal chamber includes a chamber body having a chamber wall and an interior volume; a lamp assembly disposed in the interior volume and having a plurality of lamps configured to heat a substrate; a slit valve disposed through a wall of the chamber body and above the lamp assembly to allow the substrate to pass into and out of the interior volume; an annular lamp assembly having at least one lamp disposed in a processing volume in an upper portion of the substrate anneal chamber above the slit valve; and a top reflector disposed above the annular lamp assembly to define an upper portion of the processing volume and to reflect radiation downwards towards the lamp assembly, wherein a bottom surface of the top reflector is exposed to the interior volume.

Abstract: A support system for use in a processing chamber is provided. The support system includes two or more moveable substrate supports, which include a substrate support surface and a robot, wherein the robot is configured to move the substrate support surface along a movement path. The substrate support includes a halo, and the halo protects the underlying components of the processing chamber from unwanted deposition, while the substrate support surface is moving along the movement path. The substrate support protects processing chamber components from deposition, reducing cleaning time and reducing the need for repairs of the components of the processing chamber.

Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate anneal chamber includes a chamber body having a chamber wall and an interior volume; a lamp assembly disposed in the interior volume and having a plurality of lamps configured to heat a substrate; a slit valve disposed through a wall of the chamber body and above the lamp assembly to allow the substrate to pass into and out of the interior volume; an annular lamp assembly having at least one lamp disposed in a processing volume in an upper portion of the substrate anneal chamber above the slit valve; and a top reflector disposed above the annular lamp assembly to define an upper portion of the processing volume and to reflect radiation downwards towards the lamp assembly, wherein a bottom surface of the top reflector is exposed to the interior volume.

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate support includes a substrate support pedestal having an upper surface to support a substrate and an opposing bottom surface, wherein the substrate support pedestal is formed of a material that is transparent to radiation; a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate; a pedestal support extending through the lamp assembly to support the substrate support pedestal in a spaced apart relation to the plurality of lamps; a shaft coupled to a second end of the pedestal support opposite the first end; and a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly.

Abstract: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.

Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate support includes a substrate support pedestal having an upper surface to support a substrate and an opposing bottom surface, wherein the substrate support pedestal is formed of a material that is transparent to radiation; a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate; a pedestal support extending through the lamp assembly to support the substrate support pedestal in a spaced apart relation to the plurality of lamps; a shaft coupled to a second end of the pedestal support opposite the first end; and a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly.

Abstract: A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described. Cluster tools incorporating the cooling chamber and methods of using the cooling chamber are also described.

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

Abstract: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

Abstract: Embodiments of the invention include methods and apparatuses for removing a carrier ring assembly from a carrier that includes tightly pitched slots. Embodiments include a robot arm that comprises an end effector wrist, an end effector that has a maximum thickness less than approximately 3.0 mm and a gripping device for securing a carrier ring assembly to the end effector. According to an embodiment, the gripping device may be a clamping member. One or more actuators may be used to displace the clamping member in a direction relative to the end effector. In an additional embodiment, the gripping device may be an electromagnetic device that includes a plurality of electromagnets that are inserted into a top surface of the end effector. Embodiments further include a vacuum gripping device that includes openings in a top surface of the end effector that are coupled to a vacuum controller by air-lines.

Abstract: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

Abstract: Embodiments of the invention include methods and apparatuses for removing charge from a carrier ring assembly. Embodiments include picking up a carrier ring assembly from a first location with an end effector. The charge is removed from the carrier ring assembly by one or more charge regulating surfaces formed on an end effector. According to an embodiment the charge regulating surfaces may be pads formed above top surfaces of an end effector blade. Embodiments include charge regulating surfaces that cover the entire surface of the end effector blade. Embodiments include removing charge from a carrier ring of an end effector assembly, and from a substrate supported on a conductive adhesive backing tape surrounded by the carrier ring. In an embodiment, the carrier ring assembly is then transferred to a second location with the end effector.

Abstract: Embodiments include methods and apparatuses for transferring and aligning a carrier ring. In an embodiment, a method includes lifting the carrier ring from a first location with a robot arm that includes an end effector wrist and an end effector. Front dowel pins and rear dowel pins are coupled to the end effector. In an embodiment, the end effector wrist includes a plunger that has a gripping device. Embodiments include securing the plunger to the carrier ring with the gripping device and extending the plunger out from the end effector wrist until the carrier ring contacts the front dowel pins. Thereafter, the carrier ring is transferred from the first location to the second location. The plunger and the carrier ring are then retracted until the rear dowel pins engage an alignment notch and an alignment flat on the carrier ring.

Abstract: Embodiments of the invention include methods and apparatuses for transferring a workpiece from a workpiece carrier to a system load rack. The system load rack includes slots for holding workpieces that are spaced apart from each other by a pitch that is greater than the pitch of slots in the workpiece carrier. The increased pitch of the system load rack enables a factory interface to accommodate non-standard workpieces. A method for transferring the workpieces includes contacting the workpiece in a workpiece carrier with an end-effector. Thereafter, the workpiece is removed from the workpiece carrier with the end-effector. The end-effector inserts the workpiece into a system load rack. After removing the end-effector from the system load rack, the system may be indexed to prepare for transferring a subsequent workpiece.

Abstract: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

Abstract: When an event undersells, the event promoter contacts a service provider such as Poundhouse either via phone, fax or e-mail, alerting us that they would like to “paper the house,” or fill the hall with individuals who might not otherwise go. Poundhouse then e-mails its users that an opportunity to go to a specific event is available and that they need to enter to win tickets. Users follow the link in the e-mail or come to the Web site and enter the contest by typing in their e-mail address and password. At a pre-specified time, the contest is automatically closed and “winners” are notified, via e-mail, that they won tickets to that event. The number of tickets made available to Poundhouse by the event promoter determines the number of winners. A guest list is compiled and faxed and/or e-mailed to the event promoter. Winning individuals each get to bring a single guest.

Abstract: Embodiments of the invention provide methods for processing substrates within a substrate processing system. In one embodiment, the method provides depositing a material on a substrate within a vapor deposition chamber coupled to a buffer chamber contained within a mainframe while maintaining a pressure of about 1×10?6 Torr or lower within a transfer chamber contained within the mainframe. The method further includes transferring the substrate from the vapor deposition chamber to the buffer chamber by a substrate handling robot while flowing a gas into the buffer chamber, evacuating the vapor deposition chamber, and maintaining a greater internal pressure within the buffer chamber than in the vapor deposition chamber. In some embodiments, the method includes transferring the substrate from the transfer chamber to a PVD chamber coupled to the transfer chamber by another substrate handling robot and depositing another material on the substrate within the PVD chamber.