Patents by Inventor John McConnell
John McConnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12574065Abstract: Systems and methods are provided for a transponder with several capabilities that are not present in conventional transponders. For example, an exemplary transponder in accordance with an embodiment of the present disclosure can be configured for two-way trans ponding, waveform generation, receiving, and antenna S11 measurement. In an embodiment, a transponder in accordance with an embodiment of the present disclosure can support multiple operating modes simultaneously. For example, a transponder in accordance with an embodiment of the present disclosure can interleave transponding, direct digital receiver, and waveform generation modes according to an order of precedence.Type: GrantFiled: September 29, 2023Date of Patent: March 10, 2026Assignee: The Government of the United States of America, as represented by the Secretary of the NavyInventors: Serafin Rodriguez, John McConnell, John Glancy, William Lee
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Publication number: 20250112664Abstract: Systems and methods are provided for a transponder with several capabilities that are not present in conventional transponders. For example, an exemplary transponder in accordance with an embodiment of the present disclosure can be configured for two-way trans ponding, waveform generation, receiving, and antenna S11 measurement. In an embodiment, a transponder in accordance with an embodiment of the present disclosure can support multiple operating modes simultaneously. For example, a transponder in accordance with an embodiment of the present disclosure can interleave transponding, direct digital receiver, and waveform generation modes according to an order of precedence.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Serafin Rodriguez, John McConnell, John Glancy, William Lee
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Patent number: 11712130Abstract: A food processor for processing food stuffs having a base assembly, a jar assembly, and a blade assembly that can be rotated from a use position to a stored position is disclosed. The food processor includes a lid that is connected to the jar assembly by a hinge and closed by use of a latch. The jar assembly is connected to the base assembly by the use of push pins on the base assembly which engage corresponding holes on the jar assembly.Type: GrantFiled: October 8, 2021Date of Patent: August 1, 2023Assignee: WHIRLPOOL CORPORATIONInventors: Wenkai Wu, John McConnell, David Gushwa, Andria R. Bauman
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Publication number: 20220022692Abstract: A food processor for processing food stuffs having a base assembly, a jar assembly, and a blade assembly that can be rotated from a use position to a stored position is disclosed. The food processor includes a lid that is connected to the jar assembly by a hinge and closed by use of a latch. The jar assembly is connected to the base assembly by the use of push pins on the base assembly which engage corresponding holes on the jar assembly.Type: ApplicationFiled: October 8, 2021Publication date: January 27, 2022Applicant: WHIRLPOOL CORPORATIONInventors: Wenkai Wu, John McConnell, David Gushwa, Andria R. Bauman
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Patent number: 11166592Abstract: A food processor for processing food stuffs having a base assembly, a jar assembly, and a blade assembly that can be rotated from a use position to a stored position is disclosed. The food processor includes a lid that is connected to the jar assembly by a hinge and closed by use of a latch. The jar assembly is connected to the base assembly by the use of push pins on the base assembly which engage corresponding holes on the jar assembly.Type: GrantFiled: August 14, 2018Date of Patent: November 9, 2021Assignee: WHIRLPOOL CORPORATIONInventors: Wenkai Wu, John McConnell, David Gushwa, Andria R. Bauman
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Patent number: 10681814Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: GrantFiled: September 8, 2017Date of Patent: June 9, 2020Assignee: KEMET Electronics CorporationInventors: John Bultitude, Galen W. Miller, John McConnell
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Patent number: 10671277Abstract: A portable electronic device (100) having a touch screen (112) with a floating soft trigger icon (175) for enabling various functions of the electronic device (100), such as bar code reading, capturing RFID data, capturing video and images, calling applications, and/or placing phone calls. The floating trigger icon (175) is displayed on the touch screen (112) to enable easy identification and access of the trigger icon (175). The trigger icon (175) may be selected via application of any one of various unique control gestures (200, 210, 220, 230, 240, 250, 260) to configure the electronic device (100). Based on the selected mode or function of the device (100), the trigger icon (175) may alter its appearance to facilitate use of the device (100). The operation and functionality of the trigger icon (175) may be programmed to customize operation of the device (100).Type: GrantFiled: December 16, 2015Date of Patent: June 2, 2020Assignee: DATALOGIC USA, INC.Inventors: Elva Martinez Ballesteros, Thomas Burke, John McConnell, Jacqueline Fabbi
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Publication number: 20190090694Abstract: A food processor for processing food stuffs having a base assembly, a jar assembly, and a blade assembly that can be rotated from a use position to a stored position is disclosed. The food processor includes a lid that is connected to the jar assembly by a hinge and closed by use of a latch. The jar assembly is connected to the base assembly by the use of push pins on the base assembly which engage corresponding holes on the jar assembly.Type: ApplicationFiled: August 14, 2018Publication date: March 28, 2019Applicant: WHIRLPOOL CORPORATIONInventors: Wenkai Wu, John McConnell, David Gushwa, Andria R. Bauman
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Publication number: 20190082539Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.Type: ApplicationFiled: September 8, 2017Publication date: March 14, 2019Inventors: John Bultitude, Galen W. Miller, John McConnell
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Publication number: 20190026482Abstract: Systems and devices are disclosed for providing access to selected applications on a user device based on completion of a task related to an education goal. In certain embodiments, questions or other education-related challenges are selected and submitted to a user device. A control device selects certain entertainment-based applications as restricted applications that trigger a separate access-enabling application housed on the user device when access is attempted. The access-enabling application presents the educations questions to the user and selectively permits use of the restricted application based on the response thereto.Type: ApplicationFiled: July 20, 2018Publication date: January 24, 2019Inventors: Brian Kenny, John McConnell
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Publication number: 20180368293Abstract: Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.Type: ApplicationFiled: May 7, 2018Publication date: December 20, 2018Inventors: JOHN BULTITUDE, John McConnell
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Patent number: 8910356Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.Type: GrantFiled: May 24, 2010Date of Patent: December 16, 2014Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Chris Wayne, John McConnell
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Patent number: 7958627Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.Type: GrantFiled: September 23, 2008Date of Patent: June 14, 2011Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Chris Wayne, John McConnell
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Publication number: 20100229382Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.Type: ApplicationFiled: May 24, 2010Publication date: September 16, 2010Inventors: Michael S. Randall, Chris Wayne, John McConnell
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Publication number: 20090077800Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.Type: ApplicationFiled: September 23, 2008Publication date: March 26, 2009Inventors: Michael S. Randall, Chris Wayne, John McConnell
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Publication number: 20070205950Abstract: An antenna assembly includes a plurality of antennas for use in wireless communication. A ganging member is provided for ganging the plurality of antennas in a substantially fixed relationship.Type: ApplicationFiled: March 6, 2006Publication date: September 6, 2007Applicant: LEAR CORPORATIONInventors: John McConnell, John Stack, John Nantz, Jeffrey Battistella
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Patent number: 7260574Abstract: A method and system for mapping a number of characters in a string, wherein the string comprises a combination of characters representing indexed expressions and a combination of characters representing non-indexed expressions. One embodiment produces a weight array that can be utilized to compare a first and second string having indexed and non-indexed expressions. In one embodiment, a method generates a set of special weights for characters that represent indexed and non-indexed expressions. The method then associates a weight value of an indexed expression with the specific group of characters representing a specific non-indexed expression, and generates a weight array by retrieving a plurality of special weights associated with the specific group of characters representing the specific non-indexed expression and the associated weight value of the indexed expression.Type: GrantFiled: March 29, 2005Date of Patent: August 21, 2007Assignee: Microsoft CorporationInventors: John McConnell, Julie Bennett, Yung-Shin Lin
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Publication number: 20070134944Abstract: A conductive layer connector (90) may include a first connector (96) and a second connector (98). A hinge (100) is coupled between the first connector (96) and the second connector (98). The first connector (96) and the second connector (98) are configured to clamp to an end (93) of a conductive layer (94) of an interior vehicle structural cover (16). Another conductive layer connector (140) may include a first connector (142) and a second connector (144). The first connector (142) includes a first attachment member (146) and a second attachment member (148). The second attachment member (148) is configured to extend through a conductive layer (152) of an interior vehicle structural cover (154) and to couple the first attachment member (146). A conductive member (150) is coupled to the first attachment member (146) and is configured to electrically contact the conductive layer (150). The second connector (144) extends into the first connector (142) and electrically couples the conductive member (150).Type: ApplicationFiled: December 14, 2005Publication date: June 14, 2007Applicant: LEAR CORPORATIONInventors: John Tiesler, Brian Cristea, John McConnell
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Publication number: 20070013546Abstract: Vehicle-based programmable appliance control systems and methods include a user control module and a transmitter module which are remotely located from one another. A wired connection, such as a vehicle wiring harness, directly interconnects the modules. The wired connection has two ends and is assigned solely to the modules as the user control module is connected to one end of the wired connection and the transmitter module is connected to the other end of the wired connection. The user control module includes a user control and the transmitter module includes a radio frequency transmitter. The user control module transmits a user activation signal based on assertion of the user control to the transmitter module for receipt by the transmitter via the wired connection. The transmitter transmits a radio frequency appliance activation signal based on the received user activation signal in order to activate an appliance.Type: ApplicationFiled: September 18, 2006Publication date: January 18, 2007Applicant: Lear CorporationInventors: John McConnell, John Nantz, Jason Summerford, Frank Buccinna, Mark Chuey
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Patent number: D697514Type: GrantFiled: April 10, 2012Date of Patent: January 14, 2014Assignee: Motorola Mobility LLCInventors: Chad E. Davis, Daniel T. Berg, Ajit C. Cotha, Thomas E. Gitzinger, Dickon Isaacs, John McConnell