Patents by Inventor John Merullo

John Merullo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module subassemblies
    Patent number: 9693469
    Abstract: An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: June 27, 2017
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Gary B. Tepolt, John Merullo, Jeffrey C. Thompson, Berj Nercessian
  • METHODS AND SYSTEMS FOR DETERMINING COMPROMISED HIGH SPEED DATA CHANNELS
    Publication number: 20150194046
    Abstract: An Integrated Circuit (IC) determines tampering of a communication channel between one or more components by determining, via a channel equalizer coupled to the communication channel, filter coefficients of the communication channel. The IC further compares, via a comparator, the filter coefficients to a tamper threshold and indicates tampering of the data channel when the tamper threshold is exceeded. The tamper threshold is determined by the channel equalizer based, in part, on initial filter coefficients.
    Type: Application
    Filed: February 11, 2014
    Publication date: July 9, 2015
    Applicant: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Robert Tingley, Elliot Ranger, John Merullo
  • ELECTRONIC MODULE SUBASSEMBLIES AND METHODS FOR FABRICATING THE SAME
    Publication number: 20150181709
    Abstract: An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 25, 2015
    Applicant: The Charles Stark Draper Laboratory, Inc.
    Inventors: Gary B. Tepolt, John Merullo, Jeffrey C. Thompson, Berj Nercessian