Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract: A package for mounting a power semiconductor device to a printed circuit board comprises a dielectric ceramic plate having an upper and lower surface and a grid array of holes penetrating the plate. A plurality of conductive metal contact pads that provide electrical contact for the power semiconductor device are disposed on the upper surface of the ceramic plate, and a conductive metal fills the holes. The metal-filled holes are connected to the conductive metal contact pads and provide vias from the pads to the lower surface of the ceramic plate. An array of solder balls, each ball being attached to a via at the lower surface of the ceramic plate, provide connection terminals to the printed circuit board. Sidewalls are sealably connected to the ceramic plate at its perimeter, and a lid is sealably connected to the sidewalls. The lid comprises, together with the sidewalls and ceramic plate, a hermetically sealed cavity that encloses the power semiconductor device and conductive metal contact pads.