Patents by Inventor John Michael Drosdak

John Michael Drosdak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermocouple circuit and method and system for forming same
    Patent number: 7828480
    Abstract: Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 9, 2010
    Assignee: Corning Incorporated
    Inventors: Lee Martin Adelsberg, John Michael Drosdak, Paul Richard Grzesik, Trudy A Knutson, David Myron Lineman, Kevin Barry Reiman
  • Thermocouple circuit and method and system for forming same
    Publication number: 20080175304
    Abstract: Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 24, 2008
    Inventors: Lee Martin Adelsberg, John Michael Drosdak, Paul Richard Grzesik, Trudy A. Knutson, David Myron Lineman, Kevin Barry Reiman