Abstract: An optical modulator includes first and second modulator segments. The first and second modulator segments form an optical signal path for an optical signal. The optical modulator also includes an electrical signal path capable of receiving and carrying a modulation signal, which is applied to the optical signal at the first and second modulation segments to generate a modulated optical signal. An inductive element may be disposed between electrical inputs to the first and second modulator segments. The optical modulator may be an electro-absorption modulator (EAM). The inductive element may be an inductor or a transmission line segment.

Abstract: The present invention is an electronic device including a submount for mounting a component thereon. The submount includes a first high speed transmission line electrically coupled to a contact for providing electrical contact to the component. At least two load resistors are also formed on the submount and electrically coupled to the contact. A second high speed transmission line is coupled between the two resistors to a ground electrode. The impedance and inductance of the second transmission line is desirably such as to provide a loss v. frequency characteristic that is essentially opposite to that of the first transmission line so as to produce a combined characteristic which is essentially flat.

Abstract: Optical alignment between a communication optical fiber and an optical device is achieved by using a substrate including a fiber-holding channel formed in the top surface of the substrate. The channel is particularly formed to include a central fulcrum region, against which the fiber is pressed into as the fiber-to-device alignment is performed. In particular, the fulcrum functions as a pivot point to allow for the free endface of the fiber nearest the optical device to be adjusted (performing a “fine” adjustment) by manipulating the opposing end of the fiber (using a “gross” movement) until alignment with the optical device is achieved. A reduction of, for example, 14:1 between the gross movement and the fine adjustment can be achieved by using the inventive fulcrum structure.

Abstract: A device, such as an optoelectronic device, including a submount and a cover, and a method of manufacture of such a device. The submount includes a substrate with a groove formed in the substrate. The substrate further includes at least one cavity formed in the substrate displaced from but in sufficiently close proximity to the groove so that a controlled amount of liquid adhesive, such as epoxy, in the cavity wicks into the groove when the cover is placed over the cavity and groove.

Abstract: The present invention is an electronic device including a submount for mounting a component thereon. The submount includes a first high speed transmission line electrically coupled to a contact for providing electrical contact to the component. At least two load resistors are also formed on the submount and electrically coupled to the contact. A second high speed transmission line is coupled between the two resistors to a ground electrode. The impedance and inductance of the second transmission line is desirably such as to provide a loss v. frequency characteristic that is essentially opposite to that of the first transmission line so as to produce a combined characteristic which is essentially flat.

Abstract: A device, such as an optoelectronic device, including a submount and a cover, and a method of manufacture of such a device. The submount includes a substrate with a groove formed in the substrate. The substrate further includes at least one cavity formed in the substrate displaced from but in sufficiently close proximity to the groove so that a controlled amount of liquid adhesive, such as epoxy, in the cavity wicks into the groove when the cover is placed over the cavity and groove.

Abstract: Optical alignment between a communication optical fiber and an optical device is achieved by using a substrate including a fiber-holding channel formed in the top surface of the substrate. The channel is particularly formed to include a central fulcrum region, against which the fiber is pressed into as the fiber-to-device alignment is performed. In particular, the fulcrum functions as a pivot point to allow for the free endface of the fiber nearest the optical device to be adjusted (performing a “fine” adjustment) by manipulating the opposing end of the fiber (using a “gross” movement) until alignment with the optical device is achieved. A reduction of, for example, 14:1 between the gross movement and the fine adjustment can be achieved by using the inventive fulcrum structure.

Abstract: An optical modulator includes first and second modulator segments. The first and second modulator segments form an optical signal path for an optical signal. The optical modulator also includes an electrical signal path capable of receiving and carrying a modulation signal, which is applied to the optical signal at the first and second modulation segments to generate a modulated optical signal. An inductive element may be disposed between electrical inputs to the first and second modulator segments. The optical modulator may be an electro-absorption modulator (EAM). The inductive element may be an inductor or a transmission line segment.

Abstract: A process for attaching one or more optoelectronic components to an optical submount uses an epoxy to first tack each component to its associated bondpad site. The epoxy has a sufficient strength to temporarily hold each component in place as various ones of the components are positioned, moved, etc. Once all of the components are “tacked” into position, the arrangement is heated to the solder reflow temperature, where the molten solder will displace the epoxy and form the final physical and electrical connection between the components and the submount. Preferably, the solder reflow temperature is sufficient to cure the epoxy, which then forms an inert substance that will not interfere with the performance of the final system.

Abstract: A cleaving apparatus, system and method which inhibit damage to cleave edges of laser bars are described. The cleaving apparatus includes a cleaving device having a first and a second slope meeting at a solitary cleave line. The slopes are angled to provide a solitary cleave point at the cleave line. Preferably, the first slope is between zero and four degrees and the second slope is about twenty degrees above a support structure upon which the cleaving device is mounted. A source of air may optionally provide air directed at the cleave line to assist in cleaving the laser bars.

Abstract: An apparatus and method for performing tests on laser chips that are not labor intensive and will not result in wasted parts should the laser chip fail the test is disclosed. A “bare” laser chip is subjected to a test in accordance with one embodiment by placing the laser chip on an insulating material with an embedded conducting contact through which the current to power the laser chip is passed. A cover plate provides a channel around the laser chip through which a jet of high pressure inert gas is passed to dissipate the self-heating of the laser chip that occurs during the test process. The laser chip is kept in place by physical pressure. In accordance with another embodiment, the temperature of the laser chip is measured and a thermoelectric cooler is used to cool the laser chip. The test on the “bare” laser chip eliminates the need to solder bond the laser chip to a carrier and attach wire bonds to the laser chip, thus reducing associated labor and parts costs.

Abstract: A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets.

Abstract: A laser test probe is configured to include an electronic probe and a pair of optical fibers. The electronic probe is a high speed transmission line that is used to provide the required bias signal, as well as an RF test signal, to a laser being tested. The optical fibers are used to capture the optical output signals from the front and rear faces of the laser. These optical signals are then analyzed by a measurement control unit to assess the performance of the device under test. In its most basic embodiment, the test probe can be used to identify lasers that exhibit an insufficient (in the extreme, non-existent) optical output signal.

Abstract: The invention is a laser with improved turn-on time for digital applications. The low bias capacitance effect of the laser is reduced by use of a buffer region formed between the substrate and the active region, the buffer region having a lower dopant concentration than the substrate.

Abstract: A reader for optically encoded information such as a credit card having an embossed data track includes an array of radiant energy transmitting elements and a single detector element formed on a planar chip. The chip is seated in a recessed area formed in a unitary lens assembly which includes a first integral lens array for focusing energy from each of the transmitting elements at particular points on the credit card, and a second integral lens array for focusing energy reflected from each of the points on the card onto the detector. Circuitry is provided to sequentially energize the transmitting elements, so that the focusing points, which preferably form a line transverse to the data track, are scanned. Signals from the detector element are processed by establishing a continuously variable threshold level derived as a function of the peak amount of reflected energy and by comparing the detector element output with the thresold value at several time intervals within the scanning period.