Patents by Inventor John Michael Glasko

John Michael Glasko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer contact surface protrusion profile with improved particle performance
    Patent number: 10770330
    Abstract: An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: September 8, 2020
    Assignee: ENTEGRIS, INC.
    Inventors: John Michael Glasko, I-Kuan Lin, Carlo Waldfried
  • WAFER CONTACT SURFACE PROTRUSION PROFILE WITH IMPROVED PARTICLE PERFORMANCE
    Publication number: 20190067069
    Abstract: An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.
    Type: Application
    Filed: February 2, 2017
    Publication date: February 28, 2019
    Inventors: John Michael Glasko, I-Kuan Lin, Carlo Waldfried