Publication number: 20140272459
Abstract: Components of semiconductor material processing chambers are disclosed, which may include a substrate and at least one corrosion-resistant coating formed on a surface thereof. The at least one corrosion-resistant coating is a high purity metal coating formed by a cold-spray technique. An anodized layer can be formed on the high purity metal coating. The anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more of the components are also disclosed, the components being selected from the group consisting of a chamber liner, an electrostatic chuck, a focus ring, a chamber wall, an edge ring, a plasma confinement ring, a substrate support, a baffle, a gas distribution plate, a gas distribution ring, a gas nozzle, a heating element, a plasma screen, a transport mechanism, a gas supply system, a lift mechanism, a load lock, a door mechanism, a robotic arm and a fastener.
Type:
Application
Filed:
March 12, 2013
Publication date:
September 18, 2014
Applicant:
LAM RESEARCH CORPORATION
Inventors:
John Daugherty, Hong Shih, Lin Xu, Anthony Amadio, Robert G. O'Neill, Peter Holland, Sivakami Ramanathan, Tae Won Kim, Duane Outka, John Michael Kerns, Sonia Castillo