Abstract: The present invention provides an identification device having an integrated circuit. The identification device has a first outer layer formed of a substrate. A second outer layer formed of a substrate having an antenna printed on an inner surface and an integrated circuit electrically connected to the antenna on the inner surface. The first and second outer layers are connected via a tabbed perforation.

Abstract: This and other objects are achieved by providing a security image on a substrate. The security image is formed by first stamping or otherwise transferring a first foil section on a substrate wherein the first foil section has a first sheen. A second and optionally subsequent foils are stamped or otherwise transferred over the first foil section in the form of an image or pattern. The second or subsequent foils are of a different sheen than the first foil.

Abstract: An identification device having an integrated circuit. The identification device has a first outer layer formed of a substrate. A second outer layer formed of a substrate having an antenna printed on an inner surface utilizing conductive ink, and an integrated circuit electrically connected to the antenna on the inner surface. A protective layer is secured to the first outer layer by a lamination process and an adhesive backing is secured to an outer surface of the second outer layer. The identification device may then be attached by the adhesive backing to a front surface of a conventional identification card to provide the conventional identification card with integrated circuit capabilities.

Abstract: The present invention provides an improved identification card having an integrated circuit. The identification card has a first outer layer having printed material on an outer surface and a second outer layer positioned between a laminated sleeve. The second outer layer has an integrated circuit and an antenna on an inner surface and printed material on an outer surface. The first outer layer may be optionally printed at a customer location and inserted into a subassembly having the second outer layer and an inner blocking layer positioned in the sleeve prior to final lamination.