Abstract: A method includes generating an alias that obscures identity information of a user by a remote provider computing system and receiving information relating to a prospective transaction via a digital funding group client application associated with a user computing device and communicatively coupled to the remote provider computing system via a network. The method further includes monitoring a system idle timer of the user computing device and resetting the system idle timer at predetermined time intervals, thereby maintaining the user computing device in active mode. The method further includes, while maintaining the user computing device in active mode, performing an electronic search for a sponsorship opportunity via the network, receiving a search result dataset via the network, generating a displayable result set based on the search result dataset, and rendering the displayable result set on a display. The displayable result set includes at least one prospective sponsor.

Abstract: A virtual technical networking architecture is disclosed that allows a user to locate resources, seek expertise and collaborate with identified experts located within a virtual city in order to mentor, teach and resolve problems or fill a need. The virtual city offers a gaming technology environment to users, wherein the users and experts are depicted as avatars within the virtual city and different levels of expertise and different affiliations are identified by different avatar accessories. The virtual city connects users for learning and problem resolution and also recognizes the accomplishments of experts and memorializes these accomplishments in the virtual city. Accordingly, an entire city of experts in a wide variety of fields can be built, that brings large groups of people and resources together for intellectual capital and knowledge management. The virtual city can then be used to educate, train and disseminate information.

Abstract: A virtual technical networking architecture is disclosed that allows a user to locate resources, seek expertise and collaborate with identified experts located within a virtual city in order to mentor, teach and resolve problems or fill a need. The virtual city offers a gaming technology environment to users, wherein the users and experts are depicted as avatars within the virtual city and different levels of expertise and different affiliations are identified by different avatar accessories. The virtual city connects users for learning and problem resolution and also recognizes the accomplishments of experts and memorializes these accomplishments in the virtual city. Accordingly, an entire city of experts in a wide variety of fields can be built, that brings large groups of people and resources together for intellectual capital and knowledge management. The virtual city can then be used to educate, train and disseminate information.

Abstract: A lead-frame connector and circuit module assembly allows fabrication of a pin-connector type circuit module without a circuit board substrate and discrete connector. One or more integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. Connector pins formed on an extension of the lead-frame assembly provide an electrical interface to a mating connector without requiring a separate connector mounted on a substrate. An extension of the lead-frame assembly out of the circuit interconnect plane provides a multi-row pin connector in applications where a multi-row connector is needed.

Abstract: A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.

Abstract: A memory card comprising a leadframe which includes a main frame defining a peripheral side. Extending toward the peripheral side of the main frame is a first set of leads, while extending away from the peripheral side is a second set of leads which are disposed in juxtaposed relation to respective ones of the leads of the first set. Positioned upon the main frame and electrically connected to the leads of the first and second sets is an electrical subassembly. A package body at least partially encapsulates the leadframe and the electrical subassembly. Portions of the leads of the first and second sets are exposed within the package body and mimic the structural and functional attributes of the fifty pin connector of a conventional CF card.

Abstract: A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.

Abstract: A fully-molded or lidded circuit module assembly having edge-stiffening interlock features provides packaging for memory modules and other circuit modules, while preventing de-lamination of the housing from the circuit supporting structure. The interlock features are provided around the periphery of the circuit supporting structure, which is generally a laminated circuit substrate, and mating features are provided on a lid that interlock with the interlock features or are generated by molding an encapsulation around the circuit supported structure in a fully-molded assembly. The interlocked assembly has added strength in bending, twisting or dropping, preventing internal de-lamination or lid detachment from causing circuit module failure.