Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: An apparatus for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate, wherein the plastic substrate has a first side and a second side, is provided. A textured cover is on a side of a platen, wherein the platen is on a first, untextured side of the textured cover. A first side of the dye carrier is on a second, textured side of the textured cover, and wherein the plastic substrate is supported on a second side of the dye carrier, wherein a first side of the plastic substrate is supported by the dye carrier, wherein the textured side of the textured cover has a texture to be transferred to the plastic substrate. A membrane is on the second side of the plastic substrate. A vacuum pump provides a vacuum between the membrane and the platen. A heater is positioned to heat the plastic substrate.

Abstract: A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Abstract: A method for texturing a thermoplastic substrate, while forming a dye sublimation image in the thermoplastic substrate is provided. A stack comprising a thermoplastic substrate and a plurality of processing layers is provided, wherein the plurality of processing layers comprise a dye carrier having a dye image and an elastomeric membrane and wherein at least one of the processing layers of the stack is textured. A vacuum pressure is provided on the stack through an elastomeric membrane, wherein the stack is clamped together. The stack is heated to at least a sublimation temperature of the stack, wherein texture from at least one of the process layers is transferred to the thermoplastic substrate. The thermoplastic substrate is cooled to a release temperature. The vacuum pressure is removed. The thermoplastic substrate is removed from the stack.

Abstract: A method for texturing a thermoplastic substrate, while forming a dye sublimation image in the thermoplastic substrate is provided. A stack comprising a thermoplastic substrate and a plurality of processing layers is provided, wherein the plurality of processing layers comprise a dye carrier having a dye image and an elastomeric membrane and wherein at least one of the processing layers of the stack is textured. A vacuum pressure is provided on the stack through an elastomeric membrane, wherein the stack is clamped together. The stack is heated to at least a sublimation temperature of the stack, wherein texture from at least one of the process layers is transferred to the thermoplastic substrate. The thermoplastic substrate is cooled to a release temperature. The vacuum pressure is removed. The thermoplastic substrate is removed from the stack.

Abstract: A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Abstract: A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.

Abstract: A method for forming a dye sublimation image in a plastic substrate with a sheet having an image formed thereon of a sublimatic dyestuff is provided. The image on the sheet with a treatment that deposits a silicon compound is placed against a first surface of the substrate. The sheet is heated to a sublimation temperature, which causes the image of the sheet to sublimate into the substrate. The sheet is cooled to a release temperature. The sheet is removed from the substrate.

Abstract: A method for forming a dye sublimation image in a plastic substrate with a sheet having an image formed thereon of a sublimatic dyestuff is provided. The image on the sheet with a treatment that deposits a silicon compound is placed against a first surface of the substrate. The sheet is heated to a sublimation temperature, which causes the image of the sheet to sublimate into the substrate. The sheet is cooled to a release temperature. The sheet is removed from the substrate.