Abstract: A thin-film semiconductor device comprising a substrate and a front contact layer disposed on said substrate including a plurality of segments separated by first scribe lines, a plurality of the segments forming a submodule, and at least one of the submodules forming a module. A bus is provided for interconnecting two or more of the submodules in parallel with each other. A thin film of a semiconductor material is disposed on the front contact layer and a back contact layer disposed on the thin film of semiconductor material. The back contact layer is scribed along second scribe lines corresponding to and adjacent the first scribe lines. An interconnection is provided for interconnecting adjacent areas of the rear and back contact layers.