Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber to receive an inlet fluid flow, a jet plate having at least one jet nozzle, and positioned to direct the inlet fluid flow from the inlet chamber through the at least one jet nozzle to provide an impinging fluid flow, and a heat exchange base to receive at least one semiconductor device with a frontside facing away from the inlet chamber and a backside facing the jet plate. The jet impingement cooling assembly includes an impingement layer positioned between the at least one jet nozzle and the backside of the at least one semiconductor device to receive the impinging fluid flow, the impingement layer having impingement surface structures formed thereon, and an outlet chamber positioned to receive the impinging fluid flow after the impinging fluid flow impinges on the impingement layer and the impingement surface structures.

Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.

Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.

Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.

Abstract: A fluid-cooled power module is disclosed for cooling high power semiconductor devices. Semiconductor dies supported by a direct-bonded metal structure are attached to a cooling unit that circulates coolant from an inner chamber, through spray jets, to an outer chamber, so that coolant impinges onto a metal surface in thermal contact with the direct-bonded metal structure. Use of the cooling fluid provides more efficient and cost effective cooling than relying on a solid metal heat sink. The disclosed fluid-cooled power modules can reduce the cost and weight of heat dissipation for compatibility with aerospace applications.

Abstract: A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.

Abstract: A power conversion apparatus and individual components thereof is described. In general, the power conversion apparatus converts a DC output received from an appropriate source, such as string of solar panels, to an AC output. The AC output may be a single-phase or three-phase, sinusoidal AC signal. The inverter system may include a boost converter, which is a DC-to-DC converter, and an inverter, which is essentially a DC-AC converter. In operation, the boost converter will boost the DC output from the appropriate source to a desired DC output voltage. The inverter will convert the DC output voltage to a desired single-phase or three-phase output voltage at a desired frequency, such as 50 or 60 hertz. The boost converter and the inverter may be packaged together in an appropriate sealed and weatherproof housing.

Abstract: A control system for a power converter includes a digital reference signal generator, a first proportional-integral (PI) controller, a second PI controller, and a diode. The digital reference signal generator is configured to operate in a maximum peak power tracking (MPPT) mode of operation and an output voltage control mode of operation. In the MPPT mode of operation, the digital reference signal generator is configured to receive an input voltage and an input current provided to the power converter and provide an input voltage reference signal based on the input voltage and the input current. In the output voltage control mode of operation, the digital reference signal generator is configured to provide a constant input voltage reference signal.

Abstract: A control system for a power converter includes a digital reference signal generator, a first proportional-integral (PI) controller, a second PI controller, and a diode. The digital reference signal generator is configured to operate in a maximum peak power tracking (MPPT) mode of operation and an output voltage control mode of operation. In the MPPT mode of operation, the digital reference signal generator is configured to receive an input voltage and an input current provided to the power converter and provide an input voltage reference signal based on the input voltage and the input current. In the output voltage control mode of operation, the digital reference signal generator is configured to provide a constant input voltage reference signal.

Abstract: Disclosed is a DC-DC converter with a converter bridge, tank circuitry, and rectifier circuitry. In one embodiment, the converter bridge includes multiple switch circuits, which are formed with silicon carbide MOSFETs (metal on semiconductor field effect transistors), and are configured to provide a primary current. The tank circuitry includes a resonant capacitance, a resonant inductance, and a transformer with a primary, a first secondary, and a second secondary. The tank circuitry is configured to receive the primary current, and the transformer is associated with a magnetizing inductance. The resonant frequency of the tank circuitry is greater than about 225 kilohertz as essentially defined by the magnetizing inductance, the resonant capacitance, and the resonant inductance. The rectifier circuitry is coupled to the first secondary and the second secondary coil, and is adapted to provide a rectified output current.

Abstract: Disclosed is a DC-DC converter with a converter bridge, tank circuitry, and rectifier circuitry. In one embodiment, the converter bridge includes multiple switch circuits, which are formed with silicon carbide MOSFETs (metal on semiconductor field effect transistors), and are configured to provide a primary current. The tank circuitry includes a resonant capacitance, a resonant inductance, and a transformer with a primary, a first secondary, and a second secondary. The tank circuitry is configured to receive the primary current, and the transformer is associated with a magnetizing inductance. The resonant frequency of the tank circuitry is greater than about 225 kilohertz as essentially defined by the magnetizing inductance, the resonant capacitance, and the resonant inductance. The rectifier circuitry is coupled to the first secondary and the second secondary coil, and is adapted to provide a rectified output current.

Abstract: A power conversion apparatus and individual components thereof is described. In general, the power conversion apparatus converts a DC output received from an appropriate source, such as string of solar panels, to an AC output. The AC output may be a single-phase or three-phase, sinusoidal AC signal. The inverter system may include a boost converter, which is a DC-to-DC converter, and an inverter, which is essentially a DC-AC converter. In operation, the boost converter will boost the DC output from the appropriate source to a desired DC output voltage. The inverter will convert the DC output voltage to a desired single-phase or three-phase output voltage at a desired frequency, such as 50 or 60 hertz. The boost converter and the inverter may be packaged together in an appropriate sealed and weatherproof housing.