Patents by Inventor John Mruz
John Mruz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10165675Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: GrantFiled: November 21, 2017Date of Patent: December 25, 2018Assignee: American Technical Ceramics Corp.Inventor: John Mruz
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Publication number: 20180098419Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: ApplicationFiled: November 21, 2017Publication date: April 5, 2018Applicant: American Technical Ceramics Corp.Inventor: John Mruz
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Patent number: 9854665Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: GrantFiled: January 18, 2017Date of Patent: December 26, 2017Assignee: American Technical Ceramics Corp.Inventor: John Mruz
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Publication number: 20170127511Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: ApplicationFiled: January 18, 2017Publication date: May 4, 2017Applicant: American Technical Ceramics Corp.Inventor: John Mruz
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Patent number: 9570238Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: GrantFiled: July 28, 2014Date of Patent: February 14, 2017Assignee: American Technical Ceramics Corp.Inventor: John Mruz
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Patent number: 9171669Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having an outer surface, a proximate end and a distal end being larger than proximate end. The assembly includes a conductive wire having a proximate end and a distal end and being wound about at least a portion of the non-conductive tapered core. The proximate end of the conductive wire extends away from the proximate end of the tapered core and is being conductively coupled to a micro-strip line of a circuit board. The distal end of the conductive wire extends away from the distal end of the tapered core. The conductive wire contacts at least a portion of the outer surface of the non-conductive tapered core. The assembly includes a supporting bracket coupled to the non-conductive tapered core. The supporting bracket is configured to dispose the non-conductive tapered core at a predetermined angle to the circuit board.Type: GrantFiled: January 24, 2013Date of Patent: October 27, 2015Assignee: American Technical Ceramics Corp.Inventors: Robert Grossbach, John Mruz
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Publication number: 20140333393Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: ApplicationFiled: July 28, 2014Publication date: November 13, 2014Inventor: John Mruz
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Patent number: 8797761Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: GrantFiled: December 2, 2011Date of Patent: August 5, 2014Inventor: John Mruz
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Patent number: 8446705Abstract: Disclosed are apparatus and methodology for inexpensive realization of one or more secondary capacitors within a monolithic body that already includes a first, larger capacitor to provide ultra wideband structures. Alternating layers of electrodes are provided with arm portions that embrace portions of adjacent electrode layers so as to create additional coupling effects within the capacitor structure thereby producing multiple additional equivalent capacitor structures within the device.Type: GrantFiled: August 10, 2009Date of Patent: May 21, 2013Assignee: AVX CorporationInventors: Andrew P. Ritter, John L. Galvagni, John Mruz, Robert Grossbach, Marianne Berolini
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Patent number: 8379405Abstract: An ultra-wideband assembly in an electrical circuit having a circuit board with a conductive micro-strip line is provided. The assembly includes a non-conductive tapered core having an outer surface, a distal end, and a proximate end. The distal end is being larger than proximate end. The assembly includes a conductive wire having a proximate end and a distal end and being wound about at least a portion of the non-conductive tapered core. The proximate end of the conductive wire extends away from the proximate end of the non-conductive tapered core and is being conductively coupled to the micro-strip line of the circuit board. The distal end of the conductive wire extends away from the distal end of the non-conductive tapered core. The conductive wire contacts at least a portion of the outer surface of the non-conductive tapered core. The assembly includes a supporting bracket coupled to the non-conductive tapered core. The bracket includes a base portion and a core attachment portion.Type: GrantFiled: May 4, 2011Date of Patent: February 19, 2013Assignee: American Technical Ceramics Corp.Inventors: Robert Grossbach, John Mruz
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Publication number: 20120075820Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: ApplicationFiled: December 2, 2011Publication date: March 29, 2012Applicant: AMERICAN TECHNICAL CERAMICS, CORP.Inventor: John Mruz
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Patent number: 8072773Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: GrantFiled: April 4, 2008Date of Patent: December 6, 2011Inventor: John Mruz
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Publication number: 20110267162Abstract: An ultra-wideband assembly in an electrical circuit having a circuit board with a conductive micro-strip line is provided. The assembly includes a non-conductive tapered core having an outer surface, a distal end, and a proximate end. The distal end is being larger than proximate end. The assembly includes a conductive wire having a proximate end and a distal end and being wound about at least a portion of the non-conductive tapered core. The proximate end of the conductive wire extends away from the proximate end of the non-conductive tapered core and is being conductively coupled to the micro-strip line of the circuit board. The distal end of the conductive wire extends away from the distal end of the non-conductive tapered core. The conductive wire contacts at least a portion of the outer surface of the non-conductive tapered core. The assembly includes a supporting bracket coupled to the non-conductive tapered core. The bracket includes a base portion and a core attachment portion.Type: ApplicationFiled: May 4, 2011Publication date: November 3, 2011Applicant: AMERICAN TECHNICAL CERAMICS, CORP. ONE NORDEN LANEInventors: Robert Grossbach, John Mruz
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Publication number: 20100321909Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.Type: ApplicationFiled: April 4, 2008Publication date: December 23, 2010Applicant: American Technical Ceramics, Corp.Inventor: John Mruz
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Publication number: 20100039749Abstract: Disclosed are apparatus and methodology for inexpensive realization of one or more secondary capacitors within a monolithic body that already includes a first, larger capacitor to provide ultra wideband structures. Alternating layers of electrodes are provided with arm portions that embrace portions of adjacent electrode layers so as to create additional coupling effects within the capacitor structure thereby producing multiple additional equivalent capacitor structures within the device.Type: ApplicationFiled: August 10, 2009Publication date: February 18, 2010Applicant: AVX CorporationInventors: Andrew P. Ritter, John L. Galvagni, John Mruz, Robert Grossbach, Marianne Berolini
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Patent number: 7554424Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.Type: GrantFiled: April 25, 2008Date of Patent: June 30, 2009Assignee: American Technical Ceramics CorporationInventor: John Mruz
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Publication number: 20080197940Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.Type: ApplicationFiled: April 25, 2008Publication date: August 21, 2008Inventor: John Mruz
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Patent number: 7364598Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.Type: GrantFiled: December 12, 2006Date of Patent: April 29, 2008Assignee: American Technical Ceramics CorporationInventor: John Mruz
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Patent number: 7248458Abstract: An orientation-insensitive ultra-wideband coupling capacitor. The orientation-insensitive ultra-wideband coupling capacitor includes a plurality of external surfaces, a low frequency portion, and a high frequency portion. The high frequency portion is so disposed on, and electrically connected to, the low frequency portion so as to allow the orientation-insensitive ultra-wideband coupling capacitor to work identically when mounted on any external longitudinal surface of the plurality of external surfaces thereof and thereby be readily SMT compatible without regard to special orienting procedures.Type: GrantFiled: September 14, 2004Date of Patent: July 24, 2007Assignee: American Technical Ceramics CorporationInventor: John Mruz
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Publication number: 20070084032Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.Type: ApplicationFiled: December 12, 2006Publication date: April 19, 2007Inventor: John Mruz