Abstract: A wearable device includes an elastically compliant body having a side for attaching to skin of a patient, a plurality of accelerometers for receiving acoustic wave data from acoustic waves transmitted by a transducer, a short-range radio transmitter for transmitting the acoustic wave data to a computing device, a processor for receiving the acoustic wave data from the plurality of accelerometers and providing the acoustic wave data to the short-range radio transmitter, and a battery for providing power to the processor, the plurality of accelerometers, and the short-range radio transmitter. A distance between each accelerometer of the plurality of accelerometers is predetermined. The processor, the plurality of accelerometers, the short-range radio transmitter, and the battery are embedded within the elastically compliant body.

Abstract: Systems and methods disclosed herein provide automatic expense categorization of transactions or expenditures based on a machine learning (ML) model trained using anonymized transactional data for expenditures that are stored in a public blockchain. The anonymized transactional data for the expenditure and the expense category, may be distributed throughout the blockchain network and recorded in the blockchain. In some implementations, an expenditure may be submitted to the blockchain network for expense categorization. The transactional data for the expenditure may be anonymized to remove confidential and personal identifying information (PII) before it is distributed throughout the blockchain network. Each participating node of the blockchain network may utilize the ML model to identify an expense category for the expenditure. The participating nodes may provide a consensus mechanism in order to arrive at a shared understanding of how to categorize the expenditure.

Abstract: An Internet of Things (IoT) network includes an orchestrator to issue service management requests, a service coordinator to identify components to participate in the service, and a component to perform a network service element. An IoT network includes an IoT device with service enumerator, contract enumerator, and join contract function. An IoT network apparatus includes permissions guide drafter for discovered peers, and permissions guide action executor. An IoT network apparatus includes floating service permissions guide drafter for discovered hosts, host hardware selector, floating service permissions guide executor, and service wallet value transferor. An IoT network apparatus includes permissions guide drafter for first and second discovered peers, parameter weight calculator, permissions guide term generator, and permissions guide action executor.

Abstract: The present disclosure describes a sealing processes and structure for sealing air cavity electronic packages using a thermosetting, thermal plastic, other known or as yet unknown adhesives, or hybrid combinations of such adhesive(s). Processes disclosed comprise steps of providing a base and a lid, with at least one of the base and the lid having a mating surface coated with the adhesive. Initially, an air gap is maintained between the base, the lid, and the adhesive and a vacuum is generated around the base, the lid, and the adhesive. Once the vacuum has been generated, the base and the lid are mated to create a mated package assembly with a vacuum therein. After the mating, the mated package assembly is heated to a curing temperature to cure the adhesive, and pressure may be applied as well. Because the air within the mated package assembly has been evacuated prior to heating, there is no air pressure build-up therein, reducing or eliminating the presence of blowouts and pin holes.

Abstract: The present disclosure describes a sealing processes and structure for sealing air cavity electronic packages using a thermosetting, thermal plastic, other known or as yet unknown adhesives, or hybrid combinations of such adhesive(s). Processes disclosed comprise steps of providing a base and a lid, with at least one of the base and the lid having a mating surface coated with the adhesive. Initially, an air gap is maintained between the base, the lid, and the adhesive and a vacuum is generated around the base, the lid, and the adhesive. Once the vacuum has been generated, the base and the lid are mated to create a mated package assembly with a vacuum therein. After the mating, the mated package assembly is heated to a curing temperature to cure the adhesive, and pressure may be applied as well. Because the air within the mated package assembly has been evacuated prior to heating, there is no air pressure build-up therein, reducing or eliminating the presence of blowouts and pin holes.

Abstract: A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.

Abstract: A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembl

Abstract: A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing asse

Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

Abstract: A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.

Abstract: A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.

Abstract: A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing asse

Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

Abstract: A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembl

Abstract: A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.