Abstract: A system for discretely packaging liquid or solid medication, or other substances, comprising a tray (10) with individual compartments (12) each containing a removable pot (17) and a perforated sealed sheet (21) enabling individual pots to be removed from the tray (10) for dispensing of its contents. The system also includes a computer and printer with software to create printed matter for the sheet (21) representative of the contents of the individual pots (17). An outer container (24) may receive several such filled and sealed trays (10) and an information sheet (28). One or more windows (30) in the container (24) provide a visual display of the contents. The system enables safe, accurate and easy packaging and dispensing of medication or other substances.

Abstract: A system for discretely packaging liquid or solid medication, or other substances, comprising a tray (10) with individual compartments (12) each containing a removable pot (17) and a perforated sealed sheet (21) enabling individual pots to be removed from the tray (10) for dispensing of its contents. The system also includes a computer and printer with software to create printed matter for the sheet (21) representative of the contents of the individual pots (17). An outer container (24) may receive several such filled and sealed trays (10) and an information sheet (28). One or more windows (30) in the container (24) provide a visual display of the contents. The system enables safe, accurate and easy packaging and dispensing of medication or other substances.

Abstract: Systems and methods for reducing temperature dissipation during burn-in testing are described. A plurality of devices under test are each subject to a body bias voltage. The body bias voltage reduces leakage current associated with the devices under test. Accordingly, heat dissipation is reduced during burn-in.

Abstract: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Abstract: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Abstract: An integrated circuit includes a test circuit that may be configured to generate a test signal having a predetermined pulse width in response to a control input. The test signal may track process corners of the integrated circuit and may be used to predict a failure of the integrated circuit.