Abstract: Disclosed herein is a pretreatment composition comprising a lanthanide series metal; an oxidizing agent; and a fluorometallic acid, an organophosphate compound, an organophosphonate compound, or combinations thereof. Also disclosed is a pretreatment composition comprising a lanthanide series metal; a carboxylic acid; and an oxidizing agent in an amount of no more than 70 ppm based on total weight of the pretreatment composition. Also disclosed is a system for treating a substrate comprising a cleaning composition and one of the pretreatment compositions disclosed herein. Also disclosed are methods of treating a substrate comprising contacting at least a portion of the substrate with one of the pretreatment compositions disclosed herein. Also disclosed are substrates comprising a surface having a film on at least a portion thereof, wherein the film is formed from one of the pretreatment compositions disclosed herein. Also disclosed are substrates treated with any of the systems or methods described herein.

Abstract: An ion beam system capable of providing increased secondary electron yield is provided. The increase of a secondary electron yield can be achieved by utilizing, during ion beam scanning, a combination of at least two individual gases adapted to material compositions present in a semiconductor wafer or lithography mask. The system and method can be used, for example, for inspection, circuit edit or repair of semiconductor wafers or lithography masks.

Abstract: Disclosed are devices, systems, and methods are disclosed that include: (a) a first material layer positioned on a first surface of a support structure and configured to generate secondary electrons in response to incident charged particles that strike the first layer, the first layer including an aperture configured to permit a portion of the incident charged particles to pass through the aperture; and (b) a second material layer positioned on a second surface of the support structure and separated from the first layer by a distance of 0.5 cm or more, the second layer being configured to generate secondary electrons in response to charged particles that pass through the aperture and strike the second layer, where the device is a charged particle detector.

Abstract: Systems and methods for heating an apex of a tip of a charged particle source are disclosed. The charged particle source can be, for example, a gas ion source. The systems can include a detector configured to detect light generated by the tip apex, and a controller coupled with the charged particle source and the detector so that the controller can control heating of the tip apex based on the light detected by the detector.

Abstract: Charged particle system are disclosed and include a first voltage source, a second voltage source electrically isolated from the first voltage source, a charged particle source electrically connected to the first voltage source, and an extractor electrically connected to the second voltage source. Methods relating to the charged particle systems are also disclosed.

Abstract: The disclosure relates to sample inspection using an ion-beam microscope. In some embodiments, the disclosure involves the use of multiple detectors, each of which provides different information about a sample.

Abstract: Ion sources, systems and methods are disclosed. In some embodiments, the ion sources, systems and methods can exhibit relatively little undesired vibration and/or can sufficiently dampen undesired vibration. This can enhance performance (e.g., increase reliability, stability and the like).

Abstract: Disclosed are systems and methods for applying a voltage gradient to a gas delivery system, delivering a gas through a length of the gas delivery system having the voltage gradient, the gas having a pressure-distance product of less than about 1×10?2 Torr-inches or greater than about 100 Torr-inches, and delivering the gas into a housing of an ion microscope, the housing including an emitter and an extractor.

Abstract: Cooled charged particle sources and methods are disclosed. In some embodiments, a charged particle source is thermally coupled to a solid cryogen, such as solid nitrogen. The thermal coupling can be design to provide good thermal conductivity to maintain the charged particle source at a desirably low temperature.

Abstract: Ion microscope methods and systems are disclosed. In general, the systems and methods involve relatively light isotopes, minority isotopes or both. In some embodiments, He-3 is used.

Abstract: Ion sources, systems and methods are disclosed. In some embodiments, the ion sources, systems and methods can exhibit relatively little undesired vibration and/or can sufficiently dampen undesired vibration. This can enhance performance (e.g., increase reliability, stability and the like).

Abstract: Disclosed are systems and methods for applying a voltage gradient to a gas delivery system, delivering a gas through a length of the gas delivery system having the voltage gradient, the gas having a pressure-distance product of less than about 1×010?2 Torr-inches or greater than about 100 Torr-inches, and delivering the gas into a housing of an ion microscope, the housing including an emitter and an extractor.

Abstract: Charged particle system are disclosed and include a first voltage source, a second voltage source electrically isolated from the first voltage source, a charged particle source electrically connected to the first voltage source, and an extractor electrically connected to the second voltage source. Methods relating to the charged particle systems are also disclosed.

Abstract: Systems and methods for heating an apex of a tip of a charged particle source are disclosed. The charged particle source can be, for example, a gas ion source. The systems can include a detector configured to detect light generated by the tip apex, and a controller coupled with the charged particle source and the detector so that the controller can control heating of the tip apex based on the light detected by the detector.

Abstract: Disclosed are devices, systems, and methods are disclosed that include: (a) a first material layer positioned on a first surface of a support structure and configured to generate secondary electrons in response to incident charged particles that strike the first layer, the first layer including an aperture configured to permit a portion of the incident charged particles to pass through the aperture; and (b) a second material layer positioned on a second surface of the support structure and separated from the first layer by a distance of 0.5 cm or more, the second layer being configured to generate secondary electrons in response to charged particles that pass through the aperture and strike the second layer, where the device is a charged particle detector.

Abstract: An improved method of measuring the three-dimensional surface roughness of a structure. A focused ion beam is used to mill a succession of cross-sections or “slices” of the feature of interest at pre-selected intervals over a pre-selected measurement distance. As each cross-section is exposed, a scanning electron microscope is used to measure the relevant dimensions of the feature. Data from these successive “slices” is then used to determine the three-dimensional surface roughness for the feature.

Abstract: In one aspect the invention provides a gas field ion source assembly that includes an ion source in connection with an optical column such that an ion beam generated at the ion source travels through the optical column. The ion source includes an emitter having a width that tapers to a tip comprising a few atoms. In other aspects, the methods provide for manufacturing, maintaining and enhancing the performance of a gas field ion source including sharpening the tip of the ion source in situ.

Abstract: Ion pump systems and methods are disclosed.

Abstract: Ion sources, systems and methods are disclosed.

Abstract: Ion sources, systems and methods are disclosed.