Abstract: A method of forming a contact to a semiconductor device is provided that forms an alloy composed of nickel (Ni), platinum (Pt), aluminum (Al), titanium (Ti) and a semiconductor material. The methods may include forming a nickel and platinum semiconductor alloy at a base of a via. A titanium layer having an angstrom scale thickness is deposited in the via in contact with the nickel platinum semiconductor alloy. An aluminum containing fill is deposited atop the titanium layer. A forming gas anneal including an oxygen containing atmosphere is applied to the structure to provide a contact alloy comprising nickel, platinum, aluminum, titanium and a semiconductor element from the contact surface of the semiconductor device.

Abstract: A support frame attachable to a pressurized gas cylinder pallet is disclosed. The support frame includes an adjustable first support member having a first brace and a second brace and a second support member having a third brace that extends from the first support member. The first support member is adjustable to move the first and second brace into engagement with the pallet and the third brace is slidable along the second support member to also move the third brace into engagement with the pallet. The three points of contact stabilize the support frame on the pallet such that a manifold can be connected to the support frame for connection to the cylinders on the pallet. Also disclosed is a kit including the support frame and the manifold.

Abstract: A support frame attachable to a pressurized gas cylinder pallet is disclosed. The support frame includes an adjustable first support member having a first brace and a second brace and a second support member having a third brace that extends from the first support member. The first support member is adjustable to move the first and second brace into engagement with the pallet and the third brace is slidable along the second support member to also move the third brace into engagement with the pallet. The three points of contact stabilize the support frame on the pallet such that a manifold can be connected to the support frame for connection to the cylinders on the pallet. Also disclosed is a kit including the support frame and the manifold.