Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header core includes a bore hole portion and at least two electronic connection features disposed within the bore hole portion. The bore hole portion includes at least one cavity configured to allow placement of at least one of the electronic connection features within the bore hole portion. The at least two electronic connection features are electrically coupled to the electronic module within the device container. The header core is configured to allow location of the at least two electronic connection features in a selected configuration within the bore hole portion. A header shell is disposed around the header core and attached to the device container.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device header is provided with an epoxy material having properties that produce a high strength resistance to side load failure. Examples are shown that include a surface texturing at an interface between the header and a metallic container portion.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header is coupled to the device container. The header includes a header core including a conductive member electrically coupled to the electronic module within the device container. A header shell is disposed around the header core and attached to the device container. An antenna is coupled to the header core and electrically coupled to the electronic module. A first portion of the header is proximate the antenna. The first portion includes a first dielectric constant that is lower than a second dielectric constant of a second portion of the header.

Abstract: A motor having a first portion configured to turn in a forward direction, a second portion coaxially mirrors the first portion; and a central fan between the first and second portions, and forcing air through the portions. A thermoelectric cooler element, thermally coupled to the portion is configured to cool the motor. A motor controller is electrically coupled to the first and second portions, and operates a portion in response to a condition sensed by the motor controller. The condition sensed by the motor controller is a motor torque, a motor speed, a motor casing temperature, or a zoned motor casing temperature. A method includes detecting a motor operational command; selecting a motor operational state using motor portion responsive to the motor command; sensing a heating state of a motor portion; and providing a cooling state to the motor portion responsive to the heating state.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device header is provided with an epoxy material having properties that produce a high strength resistance to side load failure. Examples are shown that include a surface texturing at an interface between the header and a metallic container portion.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header core includes a bore hole portion and at least two electronic connection features disposed within the bore hole portion. The bore hole portion includes at least one cavity configured to allow placement of at least one of the electronic connection features within the bore hole portion. The at least two electronic connection features are electrically coupled to the electronic module within the device container. The header core is configured to allow location of the at least two electronic connection features in a selected configuration within the bore hole portion. A header shell is disposed around the header core and attached to the device container.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A modular header core includes a first core module including a first bore hole portion of a first bore hole, the first bore hole portion configured to couple a first electrical component with the electronic module. A second core module includes a second bore hole portion of a second bore hole different than the first bore hole, the second bore hole portion configured to couple a second electrical component with the electronic module. The first core module is detachably engaged with the second core module. A header shell is disposed around the modular header core and attached to the device container.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header is coupled to the device container. The header includes a header core including a conductive member electrically coupled to the electronic module within the device container. A header shell is disposed around the header core and attached to the device container. An antenna is coupled to the header core and electrically coupled to the electronic module. A first portion of the header is proximate the antenna. The first portion includes a first dielectric constant that is lower than a second dielectric constant of a second portion of the header.

Abstract: Systems and methods for implantable medical devices and headers are described. In an example, an implantable medical device includes a device container including an electronic module within the device container. A header core includes an electronic connection feature electrically coupled to the electronic module within the device container, the electronic connection feature configured to engage with a lead. In some examples, the header core includes a tag holder configured to locate an identification tag in a selected position with respect to the header core. In some examples, the header core includes an antenna attachment feature configured to locate an antenna in a selected position with respect to the header core. A header shell is disposed around the header core and attached to the device container.

Abstract: A motor having a first portion configured to turn in a forward direction, a second portion coaxially mirrors the first portion; and a central fan between the first and second portions, and forcing air through the portions. A thermoelectric cooler element, thermally coupled to the portion is configured to cool the motor. A motor controller is electrically coupled to the first and second portions, and operates a portion in response to a condition sensed by the motor controller. The condition sensed by the motor controller is a motor torque, a motor speed, a motor casing temperature, or a zoned motor casing temperature. A method includes detecting a motor operational command; selecting a motor operational state using motor portion responsive to the motor command; sensing a heating state of a motor portion; and providing a cooling state to the motor portion responsive to the heating state.

Abstract: A hair curler system is formed of unique hair rollers that are stored in a hair curler station. In one aspect, the hair rollers are at least partially conical in shape. The conically-shaped rollers broaden the ability of the rollers to curl and style the hair over non-conical rollers. The conically-shaped hot rollers also provide curl and wave dimension to the hair. The hair curler station is adapted to selectively control heating of the curlers or clips that secure curlers to hair.

Abstract: A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In one application, the techniques of the present invention are used to connect circuit boards of an implantable medical device, such as a cardiac rhythm management device.

Abstract: A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In one application, the techniques of the present invention are used to connect circuit boards of an implantable medical device, such as a cardiac rhythm management device.

Abstract: A modular ballast housing for a track lighting fixture having a universal releasable connector that engages various types of lighting fixtures is disclosed.

Abstract: An optical switching arrangement, preferably an add/drop switch, provides a high degree of flexibility in manipulating optical signals by utilizing switching units that are mirror images of each other. The switching units are toggled between transmissive states and reflective states by the manipulation of index-matching fluid within trenches. In a first set of switching units, the trenches are offset in one direction relative to crosspoints of waveguides through which optical signals are propagated. In the second set of switching units, the trenches are offset in the opposite direction. As a result, the reflection characteristics of the first set of switching units are the mirror image of the reflection characteristics of the second set of switching units. In the preferred add/drop switching application, any one of a number of input ports can be optically coupled to any one of a number of drop ports and any one of a number of add ports can be optically coupled to any one of a number of output ports.