Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Abstract: An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.

Abstract: A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.

Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Abstract: A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.

Abstract: A memory card assembly is provided having a one-piece construction including a cardedge receptacle for slidingly receiving the conductive fingers of a printed circuit board and providing for an electrical connection without soldering. The one-piece construction is achieved by the injection molding of an internal frame to capture the protruding edges of the top and bottom metallic covers. Sufficient normal force of the cardedge receptacle is maintained by a brace member.

Abstract: A latch connected to a surface mount component for subsequent connection to a printed circuit board is provided as well as a method for mounting a surface mount component to a printed circuit board having a zero mounting force. The surface mount component has a soldering tail extending therefrom and at least one latch or latch contact insertable through an aperture in the printed circuit board, without force, such that the soldering tails extending from the surface mount component rest on corresponding soldering pads of the printed circuit board. As a result, surface mount components are mountable to a printed circuit board using standard, available equipment, such as a vacuum head placed component which allow for placement of the component via gravity, and the components are subsequently soldered to the printed circuit board. The assembly also includes a board latch pin and a weighted cap.

Abstract: A memory card comprises a metallic top cover, metallic bottom cover and frame housing a PC board and electrical connector. The top and bottom covers are joined by mechanical attachment to the frame and are grounded together by electro-mechanical connection and provide for grounding between the PC board and the covers. Mechanical latching mechanism provides for easy assembly of frame and covers by all vertical assembly. Integral spring tabs provide grounding of PC board and provide frictional pressure against PC board to provide stability of assembly.