Abstract: A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).

Abstract: An integrated circuit (70) is soldered to a printed circuit board (200) by first depositing flux (116) on bumps (75) of the integrated circuit. Solder (214) is deposited upon the bumps (75), and the integrated circuits is (70) placed in contact with pads (210) on the printed circuit board (200). After reflow, a solder joint (230) electrically and mechanically attaches the integrated circuit (70) to the printed circuit board (200).Alternatively, the solder tipped (214) bumps (75) may be placed in contact with a non-adhering flat plane (300) such as glass during the heating process. After reflow, each bump has a flat portion (350), and the flat portions of all the bumps form a plane (400) which further facilitates attaching the integrated circuit (70) to the printed circuit board (200).

Abstract: A substantially transparent housing (202) for an electronic device (100) is capable of enclosing at least one component (502, 504). The enclosed at least one component (502, 504) can be visible from the outside of the housing (202). The housing (202) includes an outer surface (701) and an inner surface (702). A portion of the inner surface (703) is textured to provide a translucent surface. A portion of the outer surface (704) overlaps the textured portion of the inner surface (703). The overlapping portion of the outer surface (704) has opaque marks (602). The opaque marks (602) provide information visible from the outside of the housing (202). A method is also provided for applying the opaque marks (602) to the housing (202).

Abstract: A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).

Abstract: A housing (18) for an electronic device comprises a chamber (16) having an interior (14) for receiving electronic circuitry and a detachable contaminant barrier (12) generally contouring the interior (14) of the chamber (16) for preventing foreign particles from entering the chamber (16), for removing existing foreign particles in the chamber (16), and for aiding in the handling of the housing (18) during assembly. The detachable contaminant barrier (12) includes a first protrusion (22) for manipulating said contaminant barrier (12) and said housing (18) and a second protrusion (24) for removing said contaminant barrier (12) from said housing (18).