Patents by Inventor John P. Ertel
John P. Ertel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9170387Abstract: In one embodiment, an optical component assembly includes an active component substrate, an active component positioned on the active component substrate, a collar and a fiber securing device. The collar is coupled to the active component substrate, and the fiber securing device is configured to mate with the collar such that a signal surface of the fiber securing device is located at a predetermined distance from the surface of the active component substrate, and a signal aperture of the fiber securing device is substantially located at a predetermined optical coupling location with respect to the active optical component. In another embodiment, an optical transceiver assembly includes an optically transmissive fiber securing device coupled to and aligned with a surface of the active component substrate using first and second alignment apertures that are aligned with first and second alignment locations of the active component substrate, respectively.Type: GrantFiled: September 29, 2011Date of Patent: October 27, 2015Assignee: Corning Cable Systems LLCInventors: John P. Ertel, Gary R. Trott
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Patent number: 8913858Abstract: A fiber optic interface module and assemblies using same are disclosed, wherein the modules have at least one lens that defines a folded optical path through the module body. The module operably supports one or more optical fibers adjacent an end wall. The module includes one or more lenses formed therein for coupling light from one or more light sources to the corresponding one or more optical fibers. The one or more lenses each have a folded optical path formed by total internal reflection within the module body. The one or more lenses each include a lens surface configured to define a back focus that resides within a corresponding one of the optical fibers.Type: GrantFiled: March 30, 2012Date of Patent: December 16, 2014Assignee: Corning Cable Systems LLCInventors: Mathieu Charbonneau-Lefort, John P. Ertel, Gary R. Trott
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Patent number: 8834041Abstract: In one embodiment, an optical transceiver assembly includes an active component substrate, first and second fiber securing devices, and a holder device coupled to the active component substrate. The holder device includes an active optical component recess that encloses a first and second active optical component of the active component assembly, and first and second fiber-locating holes having an engagement feature at the active optical component recess such that an end of first and second fibers inserted into the first and second fiber-locating holes are aligned with the first and second active optical components along the x-, y-, and z-axes. In another embodiment, an optical component assembly includes an active component substrate having a solder ring, a fiber securing device, and an active optical component on the active component substrate. The fiber securing device is aligned with the active optical component by the solder ring.Type: GrantFiled: September 29, 2011Date of Patent: September 16, 2014Assignee: Corning Cable Systems LLCInventors: John P. Ertel, Gary R. Trott
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Publication number: 20130259431Abstract: A fiber optic interface module and assemblies using same are disclosed, wherein the modules have at least one lens that defines a folded optical path through the module body. The module operably supports one or more optical fibers adjacent an end wall. The module includes one or more lenses formed therein for coupling light from one or more light sources to the corresponding one or more optical fibers. The one or more lenses each have a folded optical path formed by total internal reflection within the module body. The one or more lenses each include a lens surface configured to define a back focus that resides within a corresponding one of the optical fibers.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Mathieu Charbonneau-Lefort, John P. Ertel, Gary R. Trott
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Publication number: 20130084044Abstract: In one embodiment, an optical component assembly includes an active component substrate, an active component positioned on the active component substrate, a collar and a fiber securing device. The collar is coupled to the active component substrate, and the fiber securing device is configured to mate with the collar such that a signal surface of the fiber securing device is located at a predetermined distance from the surface of the active component substrate, and a signal aperture of the fiber securing device is substantially located at a predetermined optical coupling location with respect to the active optical component. In another embodiment, an optical transceiver assembly includes an optically transmissive fiber securing device coupled to and aligned with a surface of the active component substrate using first and second alignment apertures that are aligned with first and second alignment locations of the active component substrate, respectively.Type: ApplicationFiled: September 29, 2011Publication date: April 4, 2013Inventors: John P. Ertel, Gary R. Trott
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Publication number: 20130084043Abstract: In one embodiment, an optical transceiver assembly includes an active component substrate, first and second fiber securing devices, and a holder device coupled to the active component substrate. The holder device includes an active optical component recess that encloses a first and second active optical component of the active component assembly, and first and second fiber-locating holes having an engagement feature at the active optical component recess such that an end of first and second fibers inserted into the first and second fiber-locating holes are aligned with the first and second active optical components along the x-, y-, and z-axes. In another embodiment, an optical component assembly includes an active component substrate having a solder ring, a fiber securing device, and an active optical component on the active component substrate. The fiber securing device is aligned with the active optical component by the solder ring.Type: ApplicationFiled: September 29, 2011Publication date: April 4, 2013Inventors: John P. Ertel, Gary R. Trott
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Patent number: 8210788Abstract: Systems and methods for attaching a cover to a text body to create bound documents with floating and attached spines are described. In some embodiments, a solid pressure sensitive adhesive film is applied between a cover and the side hinge areas of a text body, and a cover is bound to the side hinge areas of the text body with pressure. A solid pressure sensitive adhesive tape may be dispensed from an adhesive dispenser that includes a plug-in cartridge housing, a supply spool, and a take-up spool. In other embodiments, an adhesive sheet that includes a hot melt adhesive film and a backing is applied to the text body, with the hot melt adhesive film in contact with the side hinge areas and the spine of the text body. The hot melt adhesive is exposed in areas corresponding to the side hinge areas of the text body for attaching the cover to the text body.Type: GrantFiled: April 7, 2004Date of Patent: July 3, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Raymond G. Schuder, John P. Ertel, Robert L. Cobene, Steven W. Trovinger, Ross R. Allen
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Patent number: 6986631Abstract: Systems and methods for binding a text body are described. A multi-function sheet binder is configured to heat a preformed solid hot melt adhesive to a melting temperature, form the melted adhesive by pressing the melted adhesive into a spine of a text body and folding down edges of the melted adhesive into contact with the text body, and actively cool the formed adhesive. A spot heater is configured to heat one or more localized areas of a solid hot melt adhesive to a temperature sufficient to tack the hot melt adhesive to a text body spine. An adhesive former is configured to press a localized region of a preformed heated solid hot melt adhesive into a spine of a text body and to fold down edge regions of the preformed solid hot melt adhesive into contact with the text body.Type: GrantFiled: June 24, 2003Date of Patent: January 17, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert L. Cobene, II, Steven W. Trovinger, Ross R. Allen, Raymond G. Schuder, John P. Ertel
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Patent number: 6921676Abstract: The wafer-scale assembly method provides first elements arrayed on a wafer with adjacent ones of the first elements separated by a predetermined spacing. Second elements are also provided. A spacing-defining jig is provided that includes recesses corresponding in size to the second elements. Adjacent ones of the recesses are separated by a spacing equal to the predetermined spacing. The second elements are inserted into the recesses of the spacing-defining jig and are then affixed to the wafer with the second elements in alignment with corresponding ones of the first elements. Inserting the second elements in to the jig in which the recesses are separated by a spacing equal to the predetermined spacing allows a single alignment operation to provide accurate alignment between all the first elements, e.g., image sensors, arrayed on the wafer and all the second elements, e.g., lens assemblies, that are to be affixed to the first elements arrayed on the wafer.Type: GrantFiled: March 28, 2003Date of Patent: July 26, 2005Assignee: Agilent Technologies, Inc.Inventors: John P. Ertel, Peter R. Robrish, Charles W. Hoke
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Patent number: 6866459Abstract: Systems and methods for registering a cover with respect to a text body to create bound documents with floating and attached spines are described. In one embodiment, a text body having a front end, two opposed side ends, and a spine end that is located opposite to the front end is formed from two or more sheets, and a single-piece cover is registered with respect to at least one end of the text body.Type: GrantFiled: February 26, 2001Date of Patent: March 15, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert L. Cobene, Steven W. Trovinger, Raymond G. Schuder, John P. Ertel
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Publication number: 20040240965Abstract: Systems and methods for attaching a cover to a text body to create bound documents with floating and attached spines are described. In some embodiments, a solid pressure sensitive adhesive film is applied between a cover and the side hinge areas of a text body, and a cover is bound to the side hinge areas of the text body with pressure. A solid pressure sensitive adhesive tape may be dispensed from an adhesive dispenser that includes a plug-in cartridge housing, a supply spool, and a take-up spool. In other embodiments, an adhesive sheet that includes a hot melt adhesive film and a backing is applied to the text body, with the hot melt adhesive film in contact with the side hinge areas and the spine of the text body. The hot melt adhesive is exposed in areas corresponding to the side hinge areas of the text body for attaching the cover to the text body.Type: ApplicationFiled: April 7, 2004Publication date: December 2, 2004Inventors: Raymond G. Schuder, John P. Ertel, Robert L. Cobene, Steven W. Trovinger, Ross R. Allen
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Publication number: 20040191948Abstract: The wafer-scale assembly method provides first elements arrayed on a wafer with adjacent ones of the first elements separated by a predetermined spacing. Second elements are also provided. The method imposes on the second elements spacing between adjacent ones of the second elements equal to the predetermined spacing. The second elements are then affixed to the wafer with the second elements in alignment with corresponding ones of the first elements. Imposing the spacing equal to the predetermined spacing on the second elements allows a single alignment operation to provide accurate alignment between all the first elements, e.g., image sensors, arrayed on the wafer and all the second elements, e.g., lens assemblies, that are to be affixed to the first elements arrayed on the wafer.Type: ApplicationFiled: March 28, 2003Publication date: September 30, 2004Inventors: John P. Ertel, Peter R. Robrish, Charles W. Hoke
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Patent number: 6752578Abstract: Systems and methods of binding sheets by activating a microencapsulated binding agent are described. Each sheet to be bound has an exposed binding surface region near a spine edge. A frontside adhesive system is disposed over the frontside binding surface region and comprises a binding agent that is encapsulated in a plurality of microcapsules. The adhesive system is non-tacky to enable the sheets to be stacked and individually processed until the binding agent is released from the microcapsules.Type: GrantFiled: April 30, 2001Date of Patent: June 22, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: John P. Ertel, Akinobu Kuramoto, Robert L. Cobene
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Patent number: 6739816Abstract: Systems and methods for attaching a cover to a text body to create bound documents with floating and attached spines are described. In some embodiments, a solid pressure sensitive adhesive film is applied between a cover and the side hinge areas of a text body, and a cover is bound to the side hinge areas of the text body with pressure. A solid pressure sensitive adhesive tape may be dispensed from an adhesive dispenser that includes a plug-in cartridge housing, a supply spool, and a take-up spool. In other embodiments, an adhesive sheet that includes a hot melt adhesive film and a backing is applied to the text body, with the hot melt adhesive film in contact with the side hinge areas and the spine of the text body. The hot melt adhesive is exposed in areas corresponding to the side hinge areas of the text body for attaching the cover to the text body.Type: GrantFiled: November 24, 2000Date of Patent: May 25, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Raymond G. Schuder, John P. Ertel, Robert L. Cobene, Steven W. Trovinger, Ross R. Allen
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Patent number: 6732777Abstract: Systems and methods of dispensing adhesive in a bookbinding system are described. Sheets may be bound into bound text bodies having respective spines exposed for adhesive application and characterized by multiple length dimensions and multiple thickness dimensions. In one aspect, a sheet binding system comprises an adhesive dispenser that is configured to dispense across the thickness dimension of a text body spine solid sheet adhesive having one of multiple effective widths that is sized to correspond substantially to the length dimension of the text body spine. In accordance with this approach, books of different lengths (or heights) may be readily bound with solid sheet adhesive that may be contained within a single, replaceable cartridge housing.Type: GrantFiled: May 9, 2001Date of Patent: May 11, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: John P. Ertel, Akinobu Kuramoto, Robert L. Cobene
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Publication number: 20040086359Abstract: Systems and methods of dispensing adhesive in a bookbinding system are described. Sheets may be bound into bound text bodies having respective spines exposed for adhesive application and characterized by multiple length dimensions and multiple thickness dimensions. In one aspect, a sheet binding system comprises an adhesive dispenser that is configured to dispense across the thickness dimension of a text body spine solid sheet adhesive having one of multiple effective widths that is sized to correspond substantially to the length dimension of the text body spine. In accordance with this approach, books of different lengths (or heights) may be readily bound with solid sheet adhesive that may be contained within a single, replaceable cartridge housing.Type: ApplicationFiled: October 24, 2003Publication date: May 6, 2004Inventors: John P. Ertel, Akinobu Kuramoto, Robert L. Cobene
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Patent number: 6698743Abstract: Systems and methods of determining when adhesive in a replaceable adhesive dispenser is nearly spent are described. In one aspect, a bookbinding system includes a receptacle for receiving a plug-in cartridge housing of an adhesive dispenser that contains a length of solid sheet adhesive wound into a roll, and an adhesive quantity interrogator that is configured to obtain an indication of the length of solid sheet adhesive remaining within the plug-in cartridge housing. In another aspect, an adhesive dispenser includes a plug-in cartridge housing that is configured to plug into a receptacle of a bookbinding system, a length of solid sheet adhesive that is disposed within the plug-in cartridge housing and wound into a roll, and an indicator of the length of solid sheet adhesive remaining within the plug-in cartridge housing.Type: GrantFiled: November 6, 2002Date of Patent: March 2, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Akinobu Kuramoto, Robert L. Cobene, John P. Ertel
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Publication number: 20040009054Abstract: Systems and methods for binding a text body are described. A multi-function sheet binder is configured to heat a preformed solid hot melt adhesive to a melting temperature, form the melted adhesive by pressing the melted adhesive into a spine of a text body and folding down edges of the melted adhesive into contact with the text body, and actively cool the formed adhesive. A spot heater is configured to heat one or more localized areas of a solid hot melt adhesive to a temperature sufficient to tack the hot melt adhesive to a text body spine. An adhesive former is configured to press a localized region of a preformed heated solid hot melt adhesive into a spine of a text body and to fold down edge regions of the preformed solid hot melt adhesive into contact with the text body.Type: ApplicationFiled: June 24, 2003Publication date: January 15, 2004Inventors: Robert L. Cobene, Steven W. Trovinger, Ross R. Allen, Raymond G. Schuder, John P. Ertel
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Patent number: 6641345Abstract: Systems and methods are described for increasing the binding strength of a bound text body by increasing the spinal surface area exposed for adhesive penetration greater than an area corresponding to the product of the sheet height dimension, the sheet thickness dimension and the number of sheets. In one aspect, sheet-wise conditioning of the binding area is performed prior to the application of adhesive to increase the bond area between sheets of the text body. In another aspect, the spinal surface area exposed for adhesive penetration is increased as adhesive is applied.Type: GrantFiled: December 1, 2000Date of Patent: November 4, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert L. Cobene, II, Steven W Trovinger, Christopher A Schantz, Raymond G. Schuder, John P Ertel
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Patent number: 6619900Abstract: Systems and methods for binding a text body are described. A multi-function sheet binder is configured to heat a preformed solid hot melt adhesive to a melting temperature, form the melted adhesive by pressing the melted adhesive into a spine of a text body and folding down edges of the melted adhesive into contact with the text body, and actively cool the formed adhesive. A spot heater is configured to heat one or more localized areas of a solid hot melt adhesive to a temperature sufficient to tack the hot melt adhesive to a text body spine. An adhesive former is configured to press a localized region of a preformed heated solid hot melt adhesive into a spine of a text body and to fold down edge regions of the preformed solid hot melt adhesive into contact with the text body.Type: GrantFiled: February 3, 2001Date of Patent: September 16, 2003Assignee: Hewlett-Packard Development Company, LP.Inventors: Robert L. Cobene, II, Steven W. Trovinger, Ross R. Allen, Raymond G. Schuder, John P. Ertel