Patents by Inventor John P. Haven

John P. Haven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210066830
    Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 4, 2021
    Inventors: Kevin Wilder, Alan C. Smith, James Benedict, Andrew Southworth, Thomas V. Sikina, Mary K. Herndon, John P. Haven
  • Publication number: 20210059043
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Publication number: 20210022238
    Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Inventors: Andrew Southworth, Kevin Wilder, James Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven
  • Patent number: 10849219
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 24, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 10826147
    Abstract: Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: November 3, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict
  • Patent number: 10813210
    Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 20, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina, Andrew R. Southworth
  • Publication number: 20200028257
    Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
    Type: Application
    Filed: May 21, 2019
    Publication date: January 23, 2020
    Inventors: James E. Benedict, John P. Haven, Peter J. Adams, Thomas V. Sikina
  • Publication number: 20190357363
    Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Inventors: Thomas V. Sikina, John P. Haven, Peter J. Adams, James E. Benedict, Carolyn R. Reistad
  • Publication number: 20190269007
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Publication number: 20190148837
    Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 16, 2019
    Inventors: John P. Haven, Thomas V. Sikina, Peter J. Adams, James E. Benedict
  • Publication number: 20190150296
    Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.
    Type: Application
    Filed: May 24, 2018
    Publication date: May 16, 2019
    Inventors: Andrew R. Southworth, Thomas V. Sikina, John P. Haven, James E. Benedict, Kevin Wilder
  • Publication number: 20190148807
    Abstract: Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict
  • Publication number: 20190148828
    Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth
  • Publication number: 20190150271
    Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina, Andrew R. Southworth
  • Publication number: 20190148832
    Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 16, 2019
    Inventors: Peter J. Adams, Thomas V. Sikina, John P. Haven, James E. Benedict
  • Publication number: 20180183146
    Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 28, 2018
    Applicant: Raytheon Company
    Inventors: Thomas V. Sikina, John P. Haven, Philip M. Henault, Alkim Akyurtlu
  • Patent number: 9974160
    Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 15, 2018
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Mary K. Herndon, John P. Haven, Alkim Akyurtlu