Patents by Inventor John P. Haven
John P. Haven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926089Abstract: An apparatus is provided for assisting in affixing a screen protector to a display of an electronic device. The apparatus includes a base including a platform configured to support the electronic device. The apparatus includes a lid configured to cover at least a portion of the base and the supported electronic device. The lid includes an aperture.Type: GrantFiled: May 9, 2023Date of Patent: March 12, 2024Assignee: Otter Products, LLCInventors: Richard W. Vinson, Zachariah J. Pickett, John P. Fitzgerald, Douglas A. Kempel, Jamie L. Johnson, Ross V. Bulkley, Adam J. Havens, Grady E. Barfoot
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Publication number: 20230121347Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.Type: ApplicationFiled: December 20, 2022Publication date: April 20, 2023Inventors: Andrew R. Southworth, Thomas V. Sikina, John P. Haven, James E. Benedict, Kevin Wilder
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Patent number: 11632856Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.Type: GrantFiled: July 2, 2021Date of Patent: April 18, 2023Assignee: RAYTHEON COMPANYInventors: Andrew Southworth, Kevin Wilder, James Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven
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Patent number: 11581652Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.Type: GrantFiled: January 18, 2022Date of Patent: February 14, 2023Assignee: RAYTHEON COMPANYInventors: Peter J. Adams, Thomas V. Sikina, John P. Haven, James E. Benedict
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Patent number: 11569574Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.Type: GrantFiled: May 21, 2019Date of Patent: January 31, 2023Assignee: RAYTHEON COMPANYInventors: James E. Benedict, John P. Haven, Peter J. Adams, Thomas V. Sikina
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Patent number: 11482795Abstract: An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.Type: GrantFiled: January 16, 2020Date of Patent: October 25, 2022Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, John P. Haven, Gregory M. Fagerlund, James Benedict, Andrew Southworth, Kevin Wilder
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Patent number: 11444365Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.Type: GrantFiled: March 18, 2020Date of Patent: September 13, 2022Assignee: RAYTHEON COMPANYInventors: James Benedict, Erika Klek, John P. Haven, Michael Souliotis, Thomas V. Sikina, Andrew R. Southworth, Kevin Wilder
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Patent number: 11432408Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.Type: GrantFiled: May 16, 2019Date of Patent: August 30, 2022Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, John P. Haven, Peter J. Adams, James E. Benedict, Carolyn R. Reistad
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Patent number: 11375609Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.Type: GrantFiled: November 6, 2020Date of Patent: June 28, 2022Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
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Patent number: 11336032Abstract: Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.Type: GrantFiled: May 15, 2020Date of Patent: May 17, 2022Assignee: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, Channing P. Favreau
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Publication number: 20220140485Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.Type: ApplicationFiled: January 18, 2022Publication date: May 5, 2022Inventors: Peter J. Adams, Thomas V. Sikina, John P. Haven, James E. Benedict
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Patent number: 11317502Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: GrantFiled: May 15, 2020Date of Patent: April 26, 2022Assignee: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Patent number: 11289814Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.Type: GrantFiled: November 5, 2018Date of Patent: March 29, 2022Assignee: RAYTHEON COMPANYInventors: Peter J. Adams, Thomas V. Sikina, John P. Haven, James E. Benedict
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Publication number: 20220052460Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.Type: ApplicationFiled: October 26, 2021Publication date: February 17, 2022Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth
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Publication number: 20210360772Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: ApplicationFiled: May 15, 2020Publication date: November 18, 2021Applicant: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Publication number: 20210359429Abstract: Methods and apparatus for providing a radiator having an antenna comprising a patch antenna layer and a first ground plane layer, wherein the antenna has a reactive field region of the radiator between the patch antenna layer and the first ground plane layer, and an integrated circuit located in the active region.Type: ApplicationFiled: May 15, 2020Publication date: November 18, 2021Applicant: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, Channing P. Favreau
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Publication number: 20210337651Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.Type: ApplicationFiled: July 2, 2021Publication date: October 28, 2021Inventors: Andrew Southworth, Kevin Wilder, James Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven
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Patent number: 11158955Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.Type: GrantFiled: November 7, 2018Date of Patent: October 26, 2021Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth
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Patent number: 11145952Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.Type: GrantFiled: November 14, 2019Date of Patent: October 12, 2021Assignee: RAYTHEON COMPANYInventors: Thomas V. Sikina, John P. Haven, Kevin Wilder, James E. Benedict, Andrew R. Southworth, Mary K. Herndon
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Publication number: 20210296751Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.Type: ApplicationFiled: March 18, 2020Publication date: September 23, 2021Inventors: JAMES BENEDICT, Erika Klek, John P. Haven, Michael Souliotis, Thomas V. Sikina, Andrew R. Southworth, Kevin Wilder