Patents by Inventor John P. Kalinoski

John P. Kalinoski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6635354
    Abstract: A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: October 21, 2003
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, John P. Kalinoski
  • Publication number: 20020076547
    Abstract: A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive utrelayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Application
    Filed: October 2, 2001
    Publication date: June 20, 2002
    Inventors: John P. Kalinoski, Michael H. Bunyan
  • Publication number: 20020039658
    Abstract: A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Application
    Filed: September 12, 2001
    Publication date: April 4, 2002
    Inventors: Michael H. Bunyan, John P. Kalinoski
  • Patent number: 6331349
    Abstract: A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outerlayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Grant
    Filed: January 5, 2000
    Date of Patent: December 18, 2001
    Assignee: Parker-Hannifin Corporation
    Inventors: John P. Kalinoski, Michael H. Bunyan
  • Patent number: 6303180
    Abstract: A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Grant
    Filed: September 18, 1997
    Date of Patent: October 16, 2001
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, John P. Kalinoski
  • Patent number: 6096413
    Abstract: A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outerlayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: August 1, 2000
    Assignee: Chomerics, Inc.
    Inventors: John P. Kalinoski, Michael H. Bunyan
  • Patent number: 6056527
    Abstract: An apparatus for forming an EMI shielding gasket. The gasket is a formed-in-place gasket which is deposited by an extruder. The gasket material is a fluent polymeric material having a conductive particles disposed therein. The fluent polymeric material is supplied to the extruder by a material supply system having several canisters and a mixing chamber. The fluent polymeric material is fed to a chamber in the extruder. Pressure is applied to the fluent polymeric material by a pressure supply system which includes a source of positive pressure and negative pressure, and a control module for selectively supplying positive pressure and negative pressure to the extrusion chamber.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: May 2, 2000
    Inventors: Michael H. Bunyan, John P. Kalinoski, Russell T. Lucia, Paul R. Vilandre, George R. Watchko, Rudolf I. Shvartsman, John E. Soron
  • Patent number: 5910524
    Abstract: An electrically-conductive, corrosion-resistant EMI shielding gasket having an EMI shielding effectiveness of at least about 80 dB at between about 10 MHz and 10 GHz. The gasket is formed-in-place on a surface of a substrate as applied to such surface in a form-stable bead of a fluent polymeric reaction system and cured thereon under substantially atmospheric pressure. The reaction system has a strip volume resistivity of from about 500-1000 m.OMEGA.-cm and is admixture of: (a) an elastomeric resin binder component; and (b) an electrically-conductive filler component of nickel-coated graphite particles. The substrate surface may be that of a housing or other enclosure for electronic components.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: June 8, 1999
    Assignee: Parker-Hannifin Corporation
    Inventor: John P. Kalinoski
  • Patent number: 5641438
    Abstract: A method for forming an EMI shielding gasket gasket. The gasket is a formed-in-place gasket which is deposited by an extruder. The gasket material is a fluent polymeric material having a conductive particles disposed therein. The fluent polymeric material is supplied to the extruder by a material supply system having several canisters and a mixing chamber. The fluent polymeric material is fed to a chamber in the extruder. Pressure is applied to the fluent polymeric material by a pressure supply system which includes a source of positive pressure and negative pressure, and a control module for selectively supplying positive pressure and negative pressure to the extrusion chamber.
    Type: Grant
    Filed: January 24, 1995
    Date of Patent: June 24, 1997
    Inventors: Michael H. Bunyan, John P. Kalinoski, Russell T. Lucia, Paul R. Vilandre, George R. Watchko, Rudolf I. Shvartsman, John E. Soron