Abstract: An inkjet printer configures the printheads in a printhead module in an orientation that attenuates a temperature differential between the ink drops ejected by adjacent printheads at a stitch area between the adjacent printheads. The reduced temperature differential helps ensure that the contrasts between the two inks ejected by the adjacent printheads is sufficiently similar that image quality is not adversely impacted.

Abstract: Methods, computing devices, and magnetic resonance imaging systems that improve image quality in turbo spiral echo (TSE) imaging are disclosed. With this technology, a TSE pulse sequence is generated that includes a series of radio frequency (RF) refocusing pulses to produce a corresponding series of nuclear magnetic resonance (NMR) spin echo signals. A gradient waveform including a plurality of segments is generated. The plurality of segments collectively comprise a spiral ring retraced in-out trajectory. During an interval adjacent to each of the series of RF refocusing pulses, a first gradient pulse is generated according to the gradient waveform. The first gradient pulses encode the NMR spin echo signals. An image is then constructed from digitized samples of the NMR spin echo signals obtained based at least in part on the encoding.

Abstract: A directionality detector is configured for use in an inkjet printer to attenuate the effects of ink drying in the nozzles of a printhead during printing operations. The directionality detector includes an optical sensor that generates image data of a test pattern formed on media by the printer, a diffuser that emits humidified air toward the media before the media is printed, and a controller operatively connected to the optical sensor and diffuser. The controller is configured compare the image data of the test pattern to stored image data of the test pattern printed at a previous time and determine whether any difference between the two images is greater than a predetermined threshold. The controller then operates the diffuser to direct humidified air toward the media passing the diffuser using the differences between the stored image data of the test pattern and the image data of the test pattern.

Abstract: A directionality detector is configured for use in an inkjet printer to attenuate the effects of ink drying in the nozzles of a printhead during printing operations. The directionality detector includes an optical sensor that generates image data of a test pattern formed on media by the printer, a diffuser that emits humidified air toward the media before the media is printed, and a controller operatively connected to the optical sensor and diffuser. The controller is configured compare the image data of the test pattern to stored image data of the test pattern printed at a previous time and determine whether any difference between the two images is greater than a predetermined threshold. The controller then operates the diffuser to direct humidified air toward the media passing the diffuser using the differences between the stored image data of the test pattern and the image data of the test pattern.

Abstract: An environmental conditioner in an aqueous inkjet printer conditions the print zone in the printer so aqueous ink at the nozzles of the printheads maintains its low viscosity state and does not dry. The environmental conditioner includes a humidifying chamber having a reservoir configured to contain a volume of water, a heater configured to heat the water in the water reservoir to a predetermined temperature range, an air inlet to move air into the humidifying chamber, an air discharge configured to remove humidified air from the humidifying chamber and direct the humidified air into a space between a faceplate of a printhead and a path for media passing by the faceplate of the printhead. The chamber can include an ultrasonic atomizer to produce a moisturized mist for absorption by the heated air or wicking material to transfer moisture to the air.

Abstract: An inkjet printhead prints test patches of magnetic ink having magnetic particles using different ink droplet sizes on print media. A sensor scans the test patches to determine test patch densities. A processor determines a table-based density that produces a user-selected magnetic strength by applying the selected magnetic strength to a density and magnetic strength relationship table. The processor identifies a matching test patch as one of the test patches having a density that most closely matches the table-based density, identifies a selected droplet size as the ink droplet size used to print the matching test patch, and controls the printhead to produce magnetic ink droplets of the selected droplet size when printing a print job for the selected magnetic strength.

Abstract: A method of mounting print head transducers to a diaphragm includes providing a print head transducer slab with a diaphragm, heating the transducer slab and the diaphragm to a cure temperature, pressing the diaphragm to the slab to form an assembly at the cure temperature, and dicing the slab to separate the slab into an array of print head transducers after pressing the diaphragm to the slab, wherein the array of print head transducers align with an array of body cavities, thereby mounting the array of print head transducers to the diaphragm.

Abstract: A connection assembly is disclosed for an ice maker that includes a base having a rail and a cabinet assembly having a glide. The glide slides onto the rail to removably connect the base and the cabinet assembly while aligning the cabinet assembly vertically and horizontally relative to the base. Preferably, the rail and glide have complementary geometries wherein the base and rail fit together such that the complementary geometries limit the relative vertical and horizontal movement of the rail and the glide to each other. In alternative configurations, the base may have a glide and the cabinet may have a rail. The connection assembly may also include a stop limiting the relative linear movement between the rail and the glide, further assuring proper alignment of the cabinet and the base. The connection assembly may also include a locking mechanism limiting relative linear movement of the base and the cabinet.

Abstract: A method of mounting transducers to a diaphragm includes merging a transducer slab with a diaphragm, pressing the diaphragm to the slab to form an assembly, and dicing the slab to separate the slab into an array of transducers after pressing the diaphragm to the array, wherein the array of transducers align with an array of body cavities.

Abstract: A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.

Abstract: A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.

Abstract: A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

Abstract: A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.