Abstract: Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.