Abstract: A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.

Abstract: A bio-implant having a length and a proximal and a distal end. The bio-implant has at least two lamina of dielectric material joined together, thereby defining a boundary and also defining a side surface that is intersected by this boundary. In addition, at least one set of conductors is interposed between the two lamina and extend lengthwise from the proximal end toward the distal end, each one of the set of conductors being terminated adjacent to the side surface to form a set of conductor terminations. Further, a set of electrode contact points are constructed on the side surface, with each electrode contact point contacting one of said conductor terminations.

Abstract: A bio-implant having a length and a proximal and a distal end. The bio-implant has at least two lamina of dielectric material joined together, thereby defining a boundary and also defining a side surface that is intersected by this boundary. In addition, at least one set of conductors is interposed between the two lamina and extend lengthwise from the proximal end toward the distal end, each one of the set of conductors being terminated adjacent to the side surface to form a set of conductor terminations. Further, a set of electrode contact points are constructed on the side surface, with each electrode contact point contacting one of said conductor terminations.

Abstract: An improved ultrasound transceiver array for permitting improved imaging is taught. The array may be either a two dimensional array for volumetric imaging or a one dimensional array of elements shaped to permit a more precise beam focus for finer resolution imaging. An Nd:YAG laser is used to machine a workpiece from both ends to produce kerfs which taper inwardly from the transceiving side of the array thereby permitting a stronger ultrasound signal and clearer imaging.

Abstract: An improved ultrasound transceiver array for permitting improved imaging is taught. The array may be either a two dimensional array for volumetric imaging or a one dimensional array of elements shaped to permit a more precise beam focus for finer resolution imaging. An Nd:YAG laser is used to machine a workpiece from both ends to produce kerfs which taper inwardly from the transceiving side of the array thereby permitting a stronger ultrasound signal and clearer imaging.