Abstract: A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Abstract: Packaging assembly methods and systems are disclosed herein. Initially, a plastic substrate can be provided. Thereafter, the plastic substrate can be configured as a conductive plastic trace assembly. One or more dies can be connected to the conductive plastic trace assembly, along with discrete metal components, so that the conductive plastic trace assembly functions as a combined printed circuit board and package structure including electronic circuitry. The die can be connected to the conductive plastic trace assembly utilizing a conductive adhesive. Alternatively, the die can be connected to the conductive plastic trace assembly by solder, ultrasonic bonding, and/or gold-to-gold bonding. The die is generally connected to the conductive plastic trace assembly utilizing FCOB techniques.