Abstract: A PCB test coupon is used to determine a back drilling depth to remove a stub from a PCB. A number of conductors are placed at various layers within the PCB test coupon. Vias connect each end of a conductor to a surface layer of the PCB test coupon and form test points on the surface layer of the PCB test coupon. To determine a depth of each conductor, an inductive test probe is placed on the surface layer of the PCB test coupon. The inductive test probe generates and emits an alternating magnetic field which acts on the conductors and causes a crosstalk voltage to occur across the test points. The voltage across the test points is proportional to the distance of the conductors in each layer of the PCB test coupon.

Abstract: A printed circuit board (PCB) includes a connection area and a trace extending from the connection area. A solder barrier is provided on at least a portion of the trace. The solder barrier is used in lieu of a solder mask. The solder barrier is formed by a laser oxidation process or a laser ablation process, which alters a material property of the trace. Altering the material property of the trace causes the altered portion of the trace to be non-solderable, but does not negatively impact the speed or reliability of signal transmission along the trace.

Abstract: A PCB test coupon is used to determine a back drilling depth to remove a stub from a PCB. A number of conductors are placed at various layers within the PCB test coupon. Vias connect each end of a conductor to a surface layer of the PCB test coupon and form test points on the surface layer of the PCB test coupon. To determine a depth of each conductor, an inductive test probe is placed on the surface layer of the PCB test coupon. The inductive test probe generates and emits an alternating magnetic field which acts on the conductors and causes a crosstalk voltage to occur across the test points. The voltage across the test points is proportional to the distance of the conductors in each layer of the PCB test coupon.

Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

Abstract: Methods and apparatus for testing solder joints of a PCB assembly using fluorescent-dye penetrants. The use of a suitable fluorescent-dye penetrant may significantly improve the sensitivity of a Dye and Pry test to dye indications compared to a typical sensitivity achievable thereby with a conventional dye penetrant. Some embodiments may use an automated fluorescence imaging system employing a translation stage to sequentially move individual solder-joint parts of a circuit under test into the field of view of a fluorescence microscope and a high-resolution digital camera to capture fluorescence images of the individual solder-joint parts. The movement of the translation stage and processing of the fluorescence images may be referenced to an electronic CAD file of the circuit to enable high-precision automated scanning of the solder-joint parts in the fluorescence imaging system, automated quantification of the extent of cracks in individual solder joints, and automatic generation of examination reports.

Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

Abstract: A system and means for controlling, monitoring, recording and reporting the use of power supplied for battery charging in electrically powered vehicles and their batteries; for the purposes of adjusting power loading on the electrical supply system, as well as allowing monitoring, recording, reporting and billing for such power use, and for recording, reporting and billing local and federal taxes for use of such electrical energy used for vehicle propulsion purposes.