Patents by Inventor JOHN PATTON GEIGER

JOHN PATTON GEIGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING A CIRCUIT BOARD
    Publication number: 20140290058
    Abstract: A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer.
    Type: Application
    Filed: June 10, 2014
    Publication date: October 2, 2014
    Inventors: Charles Randall Malstrom, Marjorie Kay Myers, John Patton Geiger
  • CIRCUIT BOARD
    Publication number: 20130048342
    Abstract: A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.
    Type: Application
    Filed: August 23, 2011
    Publication date: February 28, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: CHARLES RANDALL MALSTROM, MARJORIE KAY MYERS, JOHN PATTON GEIGER