Patents by Inventor John Paul Bir Singh

John Paul Bir Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF TREATING A MOLD AND FORMING A SOLID LAYER OF A SEMICONDUCTING MATERIAL THEREON
    Publication number: 20130300025
    Abstract: A method of forming a solid layer of a semiconducting material on an external surface of a treated mold which extends between a leading edge and a trailing edge comprises selectively modifying a temperature gradient of a mold such that a temperature of the leading edge (T1) is less than a temperature of the trailing edge (T2) to form the treated mold. The method further comprises submersing the treated mold into a molten semiconducting material such that the leading edge of the treated mold is first submersed into the molten semiconducting material. The method also comprises withdrawing the treated mold from the molten semiconducting material to form the solid layer of the semiconducting material on the external surface of the treated mold.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 14, 2013
    Applicant: Corning Incorporated
    Inventors: Glen Bennett Cook, Prantik Mazumder, John Paul Bir Singh