Patents by Inventor JOHN PAUL KWO

JOHN PAUL KWO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POST-DISPENSE VACUUM OVEN FOR REDUCING UNDERFILL VOIDS DURING IC ASSEMBLY
    Publication number: 20110300673
    Abstract: An IC assembly method for reducing voids in underfill material. An IC die is bonded to a substrate which creates a gap between the IC die and the substrate. An underfill material that has a curing temperature (Tuc) is dispensed around at least one side along a perimeter of the gap, where capillary forces draw the underfill material into the gap to at least partially fill the gap to form an underfilled IC assembly. After the dispensing, a vacuum oven process is applied to the underfilled IC assembly which applies a vacuum of 15 to 140 torr and a temperature that is between Tuc ?85° C. and Tuc ?5° C., for reducing voids in the underfill material. The underfill material is then cured by heating the underfilled IC assembly to a temperature ? Tuc.
    Type: Application
    Filed: June 8, 2010
    Publication date: December 8, 2011
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: EMORY TONGOL MERCADO, EDGARDO HORTALEZA, JOHN PAUL KWO