Abstract: A method of controlling oxygen levels for electroless plating of catalytic fine lines or features includes selecting a substrate that includes a plurality of catalytic lines or features that are part of or are disposed on the substrate. The plurality of catalytic lines or features include at least one catalytic fine line or feature and at least one catalytic standard line or feature. A dissolved oxygen concentration of an electroless plating solution is regulated to a candidate controlled oxygen level. The candidate controlled oxygen level is set to a smallest value in a regulated range in a first pass of the method. The substrate is submerged in the solution for a period of time sufficient to initiate plating of the at least one catalytic standard line or feature. The substrate is evaluated and candidate controlled oxygen level is incremented or the previous value is selected as the regulated oxygen level.

Abstract: A roll-to-roll electroless plating system for controlled substrate depth includes electroless plating solution disposed within an electroless plating bath, a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution, a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution, and a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution. A diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution.