Abstract: An automatic and parameterized compute implemented method for transposing wires in an integrated circuit design can y bus lines with similar impedances, and therefore similar signal transmission characteristics. Using a specially designed CAD tool, a user can specify a transposing porn, intervals at which to transpose wires, and a metal layer through which to accomplish the transposing in the integrated circuit. Using a routing database the tool then automatically determines the locations in the design where transposing needs to be performed, re-routes the wires being transposed while optimizing the circuit design space being used, and re-routes (or causes the re-route of) any other wires affected by the transposing process. The result is a new version of the routing database reflecting transposition, but with no change to the circuit's netlist.

Abstract: A method for routing conductive paths between a first datapaths and a second datapath in an integrated circuit is described. The method includes determining the degree of alignment between block one from the first datapath to block one from the second datapath, and determining the degree of alignment between block N from the first datapath to block N from the second datapath; Following the determination of the degree of alignment, the least aligned block pair to be routed is chosen from block one and block N. Next, a first horizontal track location to be used for routing the desired connection between said first datapath and said second datapath is chosen, and the corresponding conductive path is then routed using that track location. For each of the remaining unrouted block pairs, the next block pair to be routed is chosen to be the block pair immediately adjacent to the most recently routed block pair.