Patents by Inventor John Perry Whitlock

John Perry Whitlock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5835112
    Abstract: An interconnect structure and method for forming the same for electrically connecting a main contact point with a plurality of use points. The interconnect structure includes a uniform high resistance layer. A low resistance layer is formed on the uniform high resistance layer. The low resistance layer defines first and second conductors extending between a main contact point and corresponding first and second use points. The first conductor has a corresponding conductor width that is, at least in part, based on a resistance between the first and second conductors.
    Type: Grant
    Filed: October 8, 1996
    Date of Patent: November 10, 1998
    Assignee: Hewlett-Packard Company
    Inventors: John Perry Whitlock, George H. Corrigan, III