Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: Embodiments of facial garments are disclosed. Garments may include textile components having conductive paths for interconnecting sensors, actuators, or other computing devices. Garments may be facial garments configured to capture user-related input via one or more sensor devices and provide output at an actuating structure in response to the captured user-related input. The facial garment may include textile components having silver or copper yarns knitted therein to provide an anti-microbial or anti-viral barrier between the user and the user's environment. A power source may provide power through the silver or copper fibers to provide a heating surface at a surface of the facial garment or to increase effectiveness of anti-microbial or anti-viral barrier provided by the textile.

Abstract: A garment for detecting physiological data. The garment may include a garment body and a primary sensor panel affixed to a user facing side of the garment body. The primary sensor panel may include at least one bio signal sensor type to generate a primary set of bio signals. The garment may include a processor coupled to the primary sensor panel and a memory coupled to the processor. The memory may store processor-executable instructions that, when executed, configure the processor to: receive, from the primary sensor panel, the primary set of bio signals; generate a bio signal waveform based on the primary set of bio signals; and determine a hemodynamic metric associated with the user based on the bio signal waveforms associated with the user.

Abstract: A garment for detecting physiological data. The garment may include a garment body and a primary sensor panel affixed to a user facing side of the garment body. The primary sensor panel may include at least one bio signal sensor type to generate a primary set of bio signals. The garment may include a processor coupled to the primary sensor panel and a memory coupled to the processor. The memory may store processor-executable instructions that, when executed, configure the processor to: receive, from the primary sensor panel, the primary set of bio signals; generate a bio signal waveform based on the primary set of bio signals; and determine a hemodynamic metric associated with the user based on the bio signal waveforms associated with the user.

Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: In one aspect, there is provided an antimicrobial compound having the formula [Mex(NH3)y]—Z, where Me is a metal selected from the group consisting of copper, silver and zinc, and Z is selected from the group consisting of, a salt of an organic acid having at least one (—COOH) functional group, or a salt of an inorganic acid.

Abstract: A textile-based computing platform for wearing by a wearer on both sides of a joint of a body of the wearer, the platform comprising: a textile body shaped as a sleeve including a first zone for positioning adjacent to the joint, a second zone opposite the first zone for positioned on another side of the joint, and an intermediate zone for positioning over the joint; a fabric sensor incorporated into a textile layer making up the textile body, a fabric actuator incorporated into the textile layer making up the textile body, an electrical connector mounted on the textile body for connecting to a controller computing device; an electronic circuit coupling the electrical connector to the fabric sensor and the fabric actuator, the circuit electrically conductive threads incorporated into the textile layer.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.

Abstract: A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.

Abstract: A microchip wire bonder for bonding insulated bond wire to a surface, the microchip wire bonder comprising: a) a body having a stationary electrical contact configured to receive an electrical potential; b) a bond head attached to the body, to position the insulated bond wire adjacent to the surface; c) a rotating wire spooler attached to the body, to hold the insulated bond wire and to advance the insulated bond wire from the spooler to the bond head as needed; and d) an electrical contact device comprising: i) a rotating electrical connector fixed to the rotating wire spooler and being sized and shaped to receive an electrical connection with an uninsulated portion of the insulated bond wire at one end, and having a moving electrical contact at the other end, the two ends being electrically connected; and ii) a conductive bearing configured to electrically couple the moving electrical contact of the electrical connector and the stationary electrical contact; wherein, upon connecting the stationary electrica